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Macom Introduces 90 W Avionics Power Module

July 19, 2014

M/A-COM Technology Solutions ("Macom") introduced the newest entry in its portfolio of GaN in Plastic power module products.

According to a company release, Macom's new 2-stage, fully matched GaN surface mount power module, optimized for pulsed Avionics applications in the 960 to 1215 MHz band, scales to peak pulse power levels of 100 W in a 14 x 24 mm package size.

Macom noted that its new high gain GaN in Plastic power modules support surface mount technology (SMT) assembly, providing significant cost and process advantages compared to ceramic- packaged flange-mount components.

Macom's new GaN power modules feature a Land Grid Array (LGA) pattern for enhanced thermal flow and "True SMT" assembly and do not require copper coining or complicated thermal management techniques on the system PC board.

"The 90 W Avionics module is the latest GaN Module in MACOM's growing family of fully matched SMT power products," said Paul Beasly, Product Manager, MACOM. "The ease of application, system benefits and surface-mount automated assembly are of great benefit to the customer, and critically, also improve the time to market for rapidly evolving requirements in aviation and radar applications."

Macom's new GaN in Plastic 90W power modules are sampling to customers.

M/A-COM Technology Solutions Holdings is a supplier of analog RF, microwave, and millimeter wave products that enable Internet and battlefield applications.

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Source: Manufacturing Close - Up

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