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Researchers Submit Patent Application, "Compartmentalized Heat Spreader for Electromagnetic Mitigation", for Approval

July 23, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors Gilliland, Don A. (Rochester, MN); Wurth, Dennis J. (Rochester, MN), filed on January 2, 2013, was made available online on July 10, 2014.

The patent's assignee is International Business Machines Corporation.

News editors obtained the following quote from the background information supplied by the inventors: "Electromagnetic waves generated by components of integrated circuits (IC) or electronic devices in general can negatively impact electronic equipment and communication receivers. Such effects are generally known as Electromagnetic Interference (EMI) or Radio Frequency Interference (RFI). For example, EMI or RFI can cause disruption of signals utilized in the ICs. Furthermore, EMI or RFI can also cause external ambient interference with the ICs or the electronic devices. To prevent negative impacts of EMI or RFI, shielding agents can be used on the ICs or electronics devices as protective or containment shields. Specifically, the shielding agents can utilize conductive enclosures to reflect or contain electromagnetic energy on the ICs or the electronic devices. However, a solution is required that not only shields the IC or the electronic devices, but also provides dissipation for undesired EMI or RFI."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "In one embodiment of the present invention, an integrated circuit package is provided, the integrated circuit package comprises a shielding member connected to the integrated circuit package, wherein the shielding member provides a shielded enclosure to the integrated circuit package, and wherein the shielded enclosure contains internal cavities filled with frequency absorber material to dissipate radio frequency energy emitted by the integrated circuit package. The integrated circuit package further comprises a semiconductor die having an electronic material composition of the integrated circuit package. The integrated circuit package further comprises a heat spreader having a copper layer on the semiconductor die. The integrated circuit package further comprises the shielding member comprising compartments including an outer vertical layer, a top layer, and an inner vertical layer that provides heat transfer from the heat spreader to the top layer of the shielding member, and wherein the heat is transferred from the top layer of the compartments of the shielding member to a heat sink of the integrated circuit package.

"In another embodiment of the present invention, a method for compartmentalizing heat spreaders within an integrated circuit package is provided, the method comprises a shielding member providing a shielded enclosure to the integrated circuit package, wherein the shielded enclosure contains an internal cavity filled with frequency absorber material to dissipate radio frequency energy emitted by the integrated circuit package, and wherein the shielding member is connected to the integrated circuit package. The method further comprises, the shielding member providing heat transfer from heat spreaders of the integrated circuit package to compartments of the shielding member.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

"Novel characteristics of the invention are set forth in the appended claims. The invention itself, however, as well as preferred mode of use, further objectives, and advantages thereof, will be best understood by reference to the following detailed description of the invention when read in conjunction with the accompanying Figures, wherein, like reference numerals indicate like components, and:

"FIG. 1 illustrates an integrated circuit material package comprising a silicon die and a heat spreader, in accordance with an embodiment of the present invention.

"FIG. 2 illustrates heat spreaders in contact with multichip modules on a printed circuit board, in accordance with an embodiment of the present invention.

"FIG. 3 illustrates compartments with internal cavities of thermal conductive materials, in accordance with an embodiment of the present invention.

"FIG. 4 illustrates thermal conductive materials with internal cavities filled with radio frequency absorber material, in accordance with embodiments of the present invention.

"FIG. 5 illustrates an alternative embodiment of compartments of FIG. 3 with internal cavities of thermal conductive materials, in accordance with embodiments of the present invention.

"FIG. 6 illustrates a top lid of a thermal conductive material placed on top of compartments of FIG. 3 and heat spreaders of FIG. 1, in accordance with an embodiment of the present invention."

For additional information on this patent application, see: Gilliland, Don A.; Wurth, Dennis J. Compartmentalized Heat Spreader for Electromagnetic Mitigation. Filed January 2, 2013 and posted July 10, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=6213&p=125&f=G&l=50&d=PG01&S1=20140703.PD.&OS=PD/20140703&RS=PD/20140703

Keywords for this news article include: Electronics, Electromagnet, Semiconductor, International Business Machines Corporation.

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Source: Electronics Newsweekly


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