News Column

Patent Issued for Semiconductor Die Package and Embedded Printed Circuit Board

July 23, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventor Cho, Shi-Yun (Anyang-si, KR), filed on February 12, 2008, was published online on July 8, 2014.

The patent's assignee for patent number 8772918 is Samsung Electronics Co., Ltd. (Yeongtong-gu, Suwon-si, Gyeonggi-do, KR).

News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a printed circuit substrate. More particularly, the present invention relates to an embedded printed circuit substrate having passive parts embedded therein.

"An embedded printed circuit substrate has passive parts, such as capacitors, embedded therein so that wiring with active parts have short lengths. By constructing a printed circuit substrate in this matter, a more stable print circuit with an acceptable amount of reliability and predetermined electric characteristics is achieved.

"Furthermore, a conventional embedded printed circuit substrate can be constructed by employing a substrate having an area smaller than an area of an external printed circuit substrate. Therefore, the embedded printed circuit substrate has become increasingly popular and is employed in many various types of portable electric devices, particularly those in which a minimal size is desired. The above-described embedded printed circuit substrate typically is comprised of active parts, such as semiconductor dies, as well as the passive parts mounted therein, and the embedded printed circuit substrate is also employed in an antennas, etc.

"However, a conventional embedded printed circuit substrate, in which the active parts (such as the semiconductor dies) are mounted, has a problem with thermal stability. Furthermore, in the conventional embedded printed circuit substrate, the active parts generating a large amount of heat, such as the semiconductor dies, are buried in an insulating layer, thereby causing a problem in relation to heat radiation, as it is difficult to transfer heat to the exterior of the printed circuit, let alone transfer heat to, for example, a heat sink, etc.

"Such problems associated with heat radiation is often responsible for causing erroneous operation of the semiconductor dies. Therefore, with conventional printed circuits substrate having embedding of passive parts, it is often difficult to secure a stable operation characteristic, and the lifetime of such semiconductor dies can be reduced."

As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventor's summary information for this patent: "Accordingly, the present invention has been made in part to solve at least some of the above-mentioned problems occurring in the prior art, and the present invention provides a semiconductor die having an improved efficiency with regard to heat radiation.

"In addition, the present invention provides an embedded printed circuit substrate in which a semiconductor die is mounted.

"In accordance with the first exemplary aspect of the present invention, there is provided a semiconductor die package including: a semiconductor die having circuit patterns formed thereon (on the semiconductor die); a bump pad deposited on the semiconductor die and supporting at least one of bumps electrically connected to the circuit patterns; and a radiating pad formed on an upper surface of the bump pad in such a manner that the radiating pad surrounds the bumps.

"In accordance with the second exemplary aspect of the present invention, there is provided an embedded printed circuit substrate including: a semiconductor die having circuit patterns formed thereon; a bump pad having at least one bump connected to the circuit patterns formed on the semiconductor die; a radiating pad deposited on the bump pad to surround the bumps; and a core substrate having a through-hole formed therein, the through hole extending from an upper surface of the core substrate to a lower surface of the core substrate, wherein the semiconductor die is deposited on the upper surface of the core substrate such that the bumps typically extend through the through-hole."

For additional information on this patent, see: Cho, Shi-Yun. Semiconductor Die Package and Embedded Printed Circuit Board. U.S. Patent Number 8772918, filed February 12, 2008, and published online on July 8, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8772918.PN.&OS=PN/8772918RS=PN/8772918

Keywords for this news article include: Circuit Board, Semiconductor, Samsung Electronics Co. Ltd..

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Source: Electronics Newsweekly


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