News Column

Patent Issued for Optical Module and Manufacturing Method

July 23, 2014



By a News Reporter-Staff News Editor at Journal of Engineering -- According to news reporting originating from Alexandria, Virginia, by VerticalNews journalists, a patent by the inventor Choo, Heung Ro (Yuseong-Gu, KR), filed on July 21, 2009, was published online on July 8, 2014.

The assignee for this patent, patent number 8774578, is Choo; Heung Ro (Daejeon, KR).

Reporters obtained the following quote from the background information supplied by the inventors: "The present invention relates to an optical module and a method of manufacturing the same, and more particularly, to an optical module and a method of manufacturing the same, which may enable miniaturization, a reduction in the manufacturing costs in mass production, and manufacture of optical transceiver module packaging having various shapes.

"With the advent of an information-oriented society, the demand for optical modules using light by which a large amount of information may be transmitted has increased. Above all, an optical module using light should not only have excellent module characteristics but also maintain the module characteristics for a long time with high reliability.

"A low price should be maintained to promote the spread of optical modules for embodying fiber-to-the-home (FTTH). In particular, with an increase in the capacity of an optical transmission system, many attempts have continuously been made at reducing the size of an optical module to be mounted on the optical transmission system to increase the number of optical modules that may be mounted per unit area.

"One of conventional optical module is a butterfly structure in which an optical device and an electronic device are integrated on a top surface of a platform-type substrate and put in a metal case. Another conventional optical module is a TO-CAN structure in which a top surface of an integrated stem is covered with active devices (e.g., PDs or LDs) capable of optical transmission and receiving functions.

"Because a TO-CAN-type optical module requires low manufacturing costs, the TO-CAN-type optical module is being widely applied to various types of ultrahigh-speed optical communication systems. However, because there is a specific technical limit to reducing the volume of a TO-CAN package, an optical module having a new structure may be needed to enable miniaturization of optical modules."

In addition to obtaining background information on this patent, VerticalNews editors also obtained the inventor's summary information for this patent: "One or more embodiments of the present invention are directed to an optical module and a method of manufacturing the same, which may enable miniaturization, a reduction in the manufacturing costs in mass production, and manufacture of optical transceiver module packaging having various shapes.

"According to one or more embodiments of the present invention, there is provided an optical module including: a substrate including an optical device chip disposed on a top surface thereof, a spacer having at least one through hole and combined with the substrate on the substrate to insert the optical device chip into the through hole, a cover combined with the spacer on the spacer to close the through hole, and an optical fiber combined with the cover on the cover in a position corresponding to a position of the optical device chip. The optical module is configured such that light transmitted through the optical fiber is incident to the optical device chip or light emitted from the optical device chip is incident to the optical fiber.

"An electrode pattern may be further formed on the substrate and electrically connected to the optical device chip.

"The optical module may further include an electronic device chip electrically connected to the electrode pattern. The electronic device chip may be disposed under or in the vicinity of the optical device chip.

"At least one lateral surface of the substrate may protrude outward from a lateral surface of the spacer.

"The optical fiber may be fixedly combined with the cover on the cover using a transparent epoxy.

"An anti-reflective optical coating layer may be further formed on top and bottom surfaces of the cover.

"A lens may be further formed on a top surface or bottom surface of the cover in a position corresponding to the optical fiber. When the lens is formed on a top surface of the cover, the lens may be fixedly combined with the cover using a transparent epoxy such that the lens is spaced a predetermined distance apart from the optical fiber.

"A groove unit or protrusion unit having an inclined surface tilted at a predetermined angle may be formed on a top surface or bottom surface of the cover in a position corresponding to a combined position of the optical fiber.

"A lens may be further formed on the reverse surface of the top or bottom surface of the cover on which the groove unit or protrusion unit is formed. When the lens is formed on the top surface of the cover, the lens may be fixedly combined with the cover using a transparent epoxy such that the lens is spaced a predetermined distance apart from the optical fiber.

"When the substrate is mounted on a surface of an additional circuit substrate and the substrate including the circuit substrate, the spacer, the cover, and the optical fiber are partially molded, a protection tube may be further disposed to surround the optical fiber to prevent damage to the optical fiber.

"To prevent light incident to the optical device chip through the optical fiber from being reflected back toward the optical fiber, a section of the optical fiber may be cleaved in a vertical direction or at a tilted angle to an optical axis of the optical fiber and the optical fiber may be combined with the cover on the cover at a predetermined tilted angle to the cover.

"A wavelength-selective filter may be further coated on a top surface or bottom surface of the cover so that light having a specific wavelength, out of light having various wavelengths transmitted through the optical fiber, may pass through the cover.

"An optical reflective layer may be further formed on a top surface or bottom surface of the cover and combined with the optical fiber in a V shape so that light having a specific wavelength, out of light transmitted to the optical fiber in one direction, may pass through the optical device chip and the remaining light may be reflected back toward the optical fiber in another direction or so that some light having the same wavelength transmitted to the optical fiber in one direction may pass through the optical device chip and the remaining light may be reflected back toward the optical fiber in another direction.

"The optical device chip may be arranged on and combined with the substrate in an array shape.

"According to one or more embodiments of the present invention, there is provided an optical module including: a substrate including an optical device chip disposed on a top surface thereof, a spacer layer disposed on the entire surface of the substrate to mold the optical device chip, and an optical fiber combined with and disposed on the spacer layer in a position corresponding to a position of the optical device chip. Light transmitted through the optical fiber is incident to the optical device chip, or light emitted from the optical device chip is incident to the optical fiber.

"The optical fiber may be fixedly combined with the spacer layer on the spacer layer using a transparent epoxy.

"According to one or more embodiments of the present invention, there is provided an optical module including: a substrate including an optical device chip disposed on a top surface thereof, a spacer having at least one through hole and combined with the substrate on the substrate to insert the optical device chip into the through hole, and a cover combined with the spacer on the spacer to stop the through hole.

"According to one or more embodiments of the present invention, there is provided a method of manufacturing an optical module, including: combining at least one optical device chip with a substrate on the substrate, preparing a spacer having at least one through hole and combining the spacer with the substrate on the substrate to insert the optical device chip into the through hole, combining the cover with the spacer to stop the through hole, and combining an optical fiber with the cover on the cover using a transparent epoxy in a position corresponding to a position of the optical device chip.

"The optical device chip may be arranged as an array type on the substrate and combined with the substrate.

"According to one or more embodiments of the present invention, there is provided a method of manufacturing an optical module, including: preparing a substrate defined by a plurality of unit device regions, respectively arranging optical device chips on the unit device regions of the substrate and combining the optical device chips with the unit device regions of the substrate, preparing a spacer layer having a plurality of through holes and combining the spacer layer with the substrate on the substrate to respectively insert the optical device chips into the through holes of the spacer layer, combining a cover with the spacer layer to stop each of the through holes of the spacer layer, dicing the resultant structure into at least one unit device region, and respectively arranging optical fibers on the diced unit device regions of the cover in positions corresponding respectively to positions of the optical device chips and combining the optical fibers with the diced unit device regions of the cover using a transparent epoxy.

"The method may further include forming an optical reflective layer on a top surface or bottom surface of the cover. The optical fiber may be separated into a first optical fiber and a second optical fiber. The first optical fiber may be aligned and combined with the cover on the cover at a predetermined tilt angle to the cover such that light having a specific wavelength or some light having the same wavelength, out of light transmitted through the first optical fiber, is incident to the optical device chip, and the second optical fiber may be aligned with the cover on the cover at a predetermined tilted angle to the cover such that light reflected by the optical reflective layer is incident to the second optical fiber. Thereafter, the first and second optical fibers may be fixedly combined with the cover using a transparent epoxy.

"The method may further include forming an optical reflective layer on a top surface or bottom surface of the cover. The optical fiber may be manufactured in a V shape. A bottom surface of the optical fiber may be planarly polished and fixedly combined with the cover on the cover using a transparent epoxy so that light having a specific wavelength or some light having the same wavelength, out of light transmitted through the optical fiber tilted in one direction, may be incident to the optical device chip and light reflected by the optical reflective layer may be incident to the optical fiber tilted in another direction.

"According to one or more embodiments of the present invention, there is provided a method of manufacturing an optical module, including: combining at least one optical device chip with a substrate on the substrate, forming a spacer layer on the entire surface of the substrate using a transparent epoxy to mold the optical device chip, and combining an optical fiber with the spacer layer on the spacer layer in a position corresponding to a position of the optical device chip using a transparent epoxy."

For more information, see this patent: Choo, Heung Ro. Optical Module and Manufacturing Method. U.S. Patent Number 8774578, filed July 21, 2009, and published online on July 8, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8774578.PN.&OS=PN/8774578RS=PN/8774578

Keywords for this news article include: Patents.

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Source: Journal of Engineering


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