News Column

Patent Issued for Multi-Layer Array Type LED Device

July 23, 2014



By a News Reporter-Staff News Editor at Journal of Engineering -- A patent by the inventors Hwu, Jon-Fwu (Hsinchu, TW); Wu, Yung-Fu (Hsinchu, TW); Liu, Kui-Chiang (Hsinchu, TW), filed on January 19, 2012, was published online on July 8, 2014, according to news reporting originating from Alexandria, Virginia, by VerticalNews correspondents.

Patent number 8772819 is assigned to Gem Weltronics TWN Corporation (Hsinchu County, TW).

The following quote was obtained by the news editors from the background information supplied by the inventors: "The present invention relates to a multi-layer array type LED (light-emitting diode) device, and particularly relates to a multi-layer array type LED device with high luminous efficiency, which is capable of completely preventing moisture from permeating into the optical elements disposed therein.

"The light-emitting theory of LED takes advantage of the intrinsic properties of semiconductors, which is different from the theory of electric discharging, heat and light-emitting of an incandescent light tube. Because light is emitted when electric current forward flows across the PN junction of a semiconductor, the LED is also called cold light. The LED has the features of high durability, long service life, light weight, low power consumption, and being free of toxic substances like mercury, and thereby it can be widely used in the industry of luminance equipment, and the LEDs are often arranged in an array and often used in electric bulletin boards or traffic signs.

"In a conventional method for packaging a multi-layer array type LED, a substrate is provided, and two lead frames are positioned in the lead frame groove of the substrate, and then a package module is injection molded so as to encapsulate and fix the substrate and the two lead frames, and then the LED dices are arranged in the light-emitting area of the substrate, and the LED dices are electrically connected to the two lead frames, and then an insulating protection layer, and a fluorescent layer are sequentially formed on the LED dices, and then the package cover is injected to cover the package module. The LED dices are arranged in an array, and stacked one on top of another so as to form a multi-layered structure.

"However, the conventional LED device cannot be used in high-moisture environments, and severe environments such as deep sea, air space, or military. This is because each layer of the packaging structure is not airtightly connected to each other, and therefore the whole packaging structure can not be airtight. Consequently, the moisture can easily enter the interior of the packaging structure, which causes the optical elements in the packaging structure to deteriorate over time. As a result, the conventional packaging structure can not be used in a moist environment because the structural strength thereof will be gradually weakened. On the other hand, the light reflector must be manufactured before it is arranged in the LED device, which would cause the packaging efficiency to go down. In view of the above-mentioned disadvantages, a LED packaging structure, which is capable of completely preventing moisture from permeating through to it, being durable in use, and keeping the performance of optical elements for a long term, shall be provided."

In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventors' summary information for this patent: "An objective of the present invention is to provide a multi-layer array type LED device with high luminous efficiency, which is capable of completely preventing moisture from permeating into the fluorescent layer and the optical elements disposed therein.

"In order to achieve the above-mentioned objective, the present invention provides a multi-layer array type LED device comprising: a substrate, including a surface, a light output portion, and a plurality of encapsulation holes, at least one circumferential ring groove being formed around the outer periphery of light output portion, the substrate having an outer circumferential edge, the encapsulation holes being arranged around the outer periphery of the substrate near the outer circumferential edge; an encapsulation body, encapsulating the outer circumferential edge, an upper and lower periphery of the substrate, the encapsulation holes, and the circumferential ring groove, an optical chamber being formed by surrounding of the encapsulation body, the optical chamber having a light output opening corresponding to the light output portion, the optical chamber having an inner sidewall, the encapsulation body having a top surface, the inner sidewall of the optical chamber being inclined relative to a bottom surface of the optical chamber, a sealing surface extending outwardly from the top end portion of the inner sidewall being provided, there being a height difference between the sealing surface and the top surface of the encapsulation body; two lead frames, spaced apart from the substrate, and covered by the encapsulation body, two ends of each lead frame being exposed to an outside of the encapsulation body; a plurality of LED dices, arranged on the bottom surface of the optical chamber, the LED dices being electrically connected to the two lead frames; a dice protection layer, disposed on the LED dices; an optical grease layer, disposed on the dice protection layer; a fluorescent layer, disposed on the optical grease layer; a silica gel protection layer, disposed on the fluorescent layer; and a set of optical lens, used to tightly seal the light output opening.

"Among them, the reflection coefficient of the optical grease layer is at least larger than 1.5 so that the probability of the light emitted out of the optical chamber is increased."

URL and more information on this patent, see: Hwu, Jon-Fwu; Wu, Yung-Fu; Liu, Kui-Chiang. Multi-Layer Array Type LED Device. U.S. Patent Number 8772819, filed January 19, 2012, and published online on July 8, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8772819.PN.&OS=PN/8772819RS=PN/8772819

Keywords for this news article include: Gem Weltronics TWN Corporation.

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Source: Journal of Engineering


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