News Column

Patent Issued for Light Emitting Device Package Having LED Disposed in Leadframe Cavities

July 23, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- LG Innotek Co., Ltd. (Seoul, KR) has been issued patent number 8772794, according to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

The patent's inventor is Lee, Buemyeon (Seoul, KR).

This patent was filed on December 14, 2011 and was published online on July 8, 2014.

From the background information supplied by the inventors, news correspondents obtained the following quote: "The embodiment relates to a light emitting device package and a lighting system including the same.

"Light emitting devices, for example, light emitting diodes (LEDs) are semiconductor devices that convert electric energy into light and extensively used as next-generation light sources in place of conventional fluorescent lamps and glow lamps.

"Since the LED generates the light by using the semiconductor device, the LED may represent low power consumption as compared with the glow lamp that generates the light by heating tungsten or the fluorescent lamp that generates the light by urging ultraviolet ray, which is generated through the high-voltage discharge, to collide with a fluorescent substance.

"In addition, the LED generates the light by using the potential gap of the semiconductor device, so the LED is advantageous as compared with conventional light sources in terms of life span, response speed, safety and environmental-friendly requirement.

"In this regard, various studies have been performed to replace the conventional light sources with the LEDs. The LEDs are increasingly used as light sources for lighting devices, such as various lamps used indoors and outdoors, liquid crystal displays, electric signboards, and street lamps."

Supplementing the background information on this patent, VerticalNews reporters also obtained the inventor's summary information for this patent: "The embodiment provides a light emitting device package including light emitting devices, which are flip-bonded to bottoms of cavities formed at different regions of a body, and a lighting system including the same.

"The embodiment provides a light emitting device package, in which a plurality of lead frames are disposed in a plurality of cavities and light emitting devices are flip-bonded to the lead frames disposed on bottoms of the cavities, and a lighting system including the same.

"A light emitting device package according to the embodiment includes a body; a first cavity in a first region of the body; a second cavity in a second region of the body; first and second lead frames spaced apart from each other in the first cavity; a third lead frame spaced apart from the second lead frame in the second cavity; a first light emitting device on the first and second lead frames in the first cavity; a second light emitting device on the second and third lead frames in the second cavity; and a molding member in the first and second cavities.

"A light emitting device package according to the embodiment includes a body; a first cavity in a first region of the body; a second cavity in a second region of the body; first and second lead frames on a bottom surface of the first cavity; third and fourth lead frames on a bottom surface of the second cavity; a first light emitting device flip-bonded to the first and second lead frames in the first cavity; a second light emitting device flip-bonded to the third and fourth lead frames in the second cavity; and a molding member in the first and second cavities.

"A lighting system according to the embodiment includes a plurality of light emitting device packages; and a module substrate where the light emitting device packages are arrayed. Each light emitting device package includes a body; a first cavity in a first region of the body; a second cavity in a second region of the body; first and second lead frames on a bottom surface of the first cavity; third and fourth lead frames on a bottom surface of the second cavity; a first light emitting device flip-bonded to the first and second lead frames in the first cavity; a second light emitting device flip-bonded to the third and fourth lead frames in the second cavity; and a molding member in the first and second cavities."

For the URL and additional information on this patent, see: Lee, Buemyeon. Light Emitting Device Package Having LED Disposed in Leadframe Cavities. U.S. Patent Number 8772794, filed December 14, 2011, and published online on July 8, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8772794.PN.&OS=PN/8772794RS=PN/8772794

Keywords for this news article include: Electronics, Semiconductor, LG Innotek Co. Ltd..

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


For more stories covering the world of technology, please see HispanicBusiness' Tech Channel



Source: Electronics Newsweekly


Story Tools






HispanicBusiness.com Facebook Linkedin Twitter RSS Feed Email Alerts & Newsletters