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Patent Issued for Heat-Dissipating Device and Electric Apparatus Having the Same

July 23, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- Zaonzi Co., Ltd. (Seoul, KR) has been issued patent number 8773855, according to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

The patent's inventor is Lee, Sang-Cheol (Gyeonggi-do, KR).

This patent was filed on November 21, 2011 and was published online on July 8, 2014.

From the background information supplied by the inventors, news correspondents obtained the following quote: "The present invention relates to a heat-dissipating device and an electronic apparatus having the heat-dissipating device.

"Generally, electronic components, such as the central processing unit (CPU) of a computer, the chipset of a video card, power transistors, and light-emitting diodes (LEDs), generate heat during the operation. If the electronic component overheats, it may malfunction or be damaged, and thus a heat-dissipating device may be essentially required to prevent the electronic component from overheating.

"Typically, by dissipating the heat generated in a heat source, the heat-dissipating device can prevent the heat source such as the electronic component from overheating.

"An example of the heat-dissipating device employed in the electronic component is the conventional pin-structured heat-dissipating device.

"However, with the conventional pin-structured heat-dissipating device, it is difficult to maintain the surface area of the heat transfer pins wide while electronic components that are becoming smaller require that the size of heat-receiving portions be smaller. Even if the surface area of the heat transfer pins is made wider, the distance between the heat-receiving portions and heat-dissipating portions becomes greater, leading to slower heat transfer and thus limiting the improvement of heat dissipating efficiency.

"It is also difficult to apply the conventional heat transfer pins in a large-size heat source, such as the RF modulator, because of the restricted size of the heat transfer pins, which are commonly extrusion-molded, of the conventional heat-dissipating device. Moreover, the pin-structured heat-dissipating device used in a large heat source has thicker heat transfer pins due to the consideration of structural stability and heat dissipating efficiency, hindering the reduction of weight and increasing the manufacturing costs.

"To complement these limits, the conventional heat-dissipating device may further include a high-speed heat dissipating fan. However, adding the heat dissipating fan also causes a problem of noise and increased power consumption."

Supplementing the background information on this patent, VerticalNews reporters also obtained the inventor's summary information for this patent: "The present invention provides a heat-dissipating device that has a high heat transfer performance and a high efficiency in dissipating heat and an electronic apparatus equipped with the heat-dissipating device.

"The present invention also provides a heat-dissipating device that can be applied to a large heat source and an electronic apparatus equipped with the heat-dissipating device.

"Furthermore, the present invention provides a heat-dissipating device that operates without noise or with little noise.

"An aspect of the present invention provides a heat-dissipating device that includes a heat-transferring heat pipe unit having a wick type of a heat pipe, in which a wick is formed on an inner surface of the heat pipe and a working fluid is injected into the heat pipe, and a heat-dissipating heat pipe unit having an oscillating capillary type of a loop heat pipe, in which the loop heat pipe is formed as a capillary and a working fluid is injected into the loop heat pipe. Here, the heat pipe includes a radiator being disposed adjacent to a heat source and transporting heat transferred from the heat source to the loop heat pipe, and the loop heat pipe includes a heat-receiving portion and a heat-dissipating portion, in which the heat-receiving portion is thermally coupled to the radiator and the heat-dissipating portion releases heat absorbed from the heat-receiving portion.

"The heat-dissipating device can further include a heat transfer block having a base. One surface of the base is in contact with a heat source, and the other surface of the base having a holding groove formed therein is for the heat pipe.

"The loop heat pipe can have a spirally shaped structure.

"The heat-dissipating heat pipe unit can include an outer loop heat pipe, which is disposed on an outer side, and at least one inner loop heat pipe, which surrounds an inner circumference of the outer loop heat pipe in such a way that the inner loop heat pipe is separated from the outer loop heat pipe. The heat-transferring heat pipe unit can include at least one heat pipe, which is coupled to the inner and outer loop heat pipes.

"The inner and outer loop heat pipes can be formed in the shape of a circular loop or a rectangular loop.

"The heat-dissipating device can further include a heat-dissipating fan, which is disposed on one side of the heat-dissipating heat pipe unit and enables circulation of air through an inner space of the loop heat pipe.

"The heat-dissipating heat pipe unit can include a loop heat pipe. Here, the loop heat pipe is disposed in the shape of a ring so as to form a radially disposed heat-dissipating portion.

"The heat-transferring heat pipe unit can include a heat pipe having a ring-shaped radiator, and the heat-dissipating heat pipe unit can include a pair of ring-shaped loop heat pipes, which are coupled to an inner side and an outer side of the ring-shaped radiator, respectively.

"The pair of ring-shaped loop heat pipes can be formed in such a way that a distance between circles of the ring-shaped loop heat pipes become wider from one side to the other side. Here, the one side is coupled to the ring-shaped radiator.

"The heat-dissipating heat pipe unit can include a plurality of loop heat pipes being disposed in a radial direction.

"The heat-transferring heat pipe unit can include at least one heat pipe having radiators, in which the radiators are arranged symmetrically, and the heat-dissipating heap pipe unit can include a pair of loop heat pipes, in which the pair of loop heat pipes are coupled to the symmetrically arranged radiators interchangeably and are partly overlapped with each other.

"Another aspect of the present invention provides an electronic apparatus that includes a substrate, which has a heat source mounted thereon, a case, which has the substrate installed therein, and a heat-dissipating device, which is coupled to the heat source.

"In the heat-dissipating device, the heat-transferring heat pipe unit can include multiple pairs of radiators, and the heat-dissipating heat pipe unit can include multiple pairs of unit loop heat pipes, which are arranged in parallel.

"The electronic apparatus can further include a partition. Here, the partition is installed in the case so as to divide an inner space of the case, the substrate is installed on one surface of the partition, and the heat-dissipating heat pipe unit is installed on the other surface of the partition.

"Additional aspects and advantages of the present invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention."

For the URL and additional information on this patent, see: Lee, Sang-Cheol. Heat-Dissipating Device and Electric Apparatus Having the Same. U.S. Patent Number 8773855, filed November 21, 2011, and published online on July 8, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8773855.PN.&OS=PN/8773855RS=PN/8773855

Keywords for this news article include: Zaonzi Co. Ltd, Electronic Components.

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


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Source: Electronics Newsweekly


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