Patent number 8773859 is assigned to
The following quote was obtained by the news editors from the background information supplied by the inventors: "This disclosure relates to transferring heat generated by an integrated circuit (IC) chip of a driver assembly for supplying operating signals to a display device to prevent overheating of the IC chip.
"Display devices are used for displaying information on a display panel for visual interaction with users. Various types of display technologies were developed and currently available for use in electronic devices. The display devices may incorporate various types of technology including, among others, liquid crystal display (LCD) technology, organic light emitting display (OLED) technology, electrophoretic display technology, field emission display (FED) technology, and plasma display technology. In general, display devices include a display panel and a driver assembly for providing signals to operate pixel elements in the display panel.
"One conventional way of implementing the driver assembly is by using chip-on-film (COF) technology. The COF generally uses a film (e.g., flexible substrate) and a driver integrated circuit (IC) chip mounted on the film. Wiring patterns are formed on the film and bumps are placed between the driver IC and the film to connect the driver IC to the wiring patterns. The wiring patterns connect the IC chip to signal lines of a display panel.
"As the size of the display panel increases, the operating frequency and the operating voltage of the driver IC chip also increases. The increased frequency and the operating voltage of the driver IC increases the heat generated within the driver IC. Such increase the internal heat generation can cause the driver IC to overheat, resulting in malfunctioning as well as damage to the driver IC chip. The heating of the driver IC chip can compromise the reliability of the display device."
In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventors' summary information for this patent: "Embodiments relate to a driver assembly with an efficient mechanism for transferring heat away from an integrated circuit (IC) chip via a heat transfer member and conductive pattern lines formed on a substrate. The IC chip is mounted on connectors and is placed above the substrate. The IC chip operatively communicates with the display panel via at least a subset of the conductive pattern lines and a subset of the connectors. A heat transfer member is formed on the substrate and is configured to transfer heat generated by the integrated circuit to a component having a lower temperature than the IC chip. A heat transfer element is placed between the IC chip and the heat transfer member to transfer the heat generated by the IC chip to the heat transfer member.
"In one or more embodiments, the driver assembly is a chip on film (COF) device.
"In one or more embodiments, the driver assembly includes an electrically insulating layer partly covering the conductive pattern lines. The connectors are placed on the part of the conductive pattern lines not covered by the electrically insulating layer and extend between the conductive pattern lines and the IC chip.
"In one or more embodiments, the drive assembly generates signals for transmission over scan lines or data lines of the display panel.
"In one or more embodiments, the conductive pattern lines include one or more lines connecting the heat transfer member and the component to transfer heat from the heat transfer member to the component.
"In one or more embodiments, the one or more lines further carry electric signals or reference voltage to or from the IC chip.
"In one or more embodiments, the heat transfer element is formed on or attached to a bottom of the IC chip. The heat transfer element may have a flat configuration with an area smaller than the bottom surface of the IC chip.
"In one or more embodiments, the heat transfer element is a filler material injected between the IC chip and the heat transfer member. The filler material is electrically non-conductive but thermally conductive. The filler material may cover an entire bottom surface of the IC chip.
"In one or more embodiments, the heat transfer member and the plurality of conductive pattern lines are formed in the same fabrication process and are formed of the same material. The fabrication process may include depositing a layer of conductive film on the substrate and etching the deposited film."
URL and more information on this patent, see: Kim, JinHyong; Kim, SeungTae. Driver Package. U.S. Patent Number 8773859, filed
Keywords for this news article include: Technology,
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