News Column

Patent Issued for Carrier with Three-Dimensional Capacitor

July 22, 2014



By a News Reporter-Staff News Editor at Journal of Technology -- According to news reporting originating from Alexandria, Virginia, by VerticalNews journalists, a patent by the inventors Kuo, Chih-Ming (Hsinchu County, TW); Ho, Lung-Hua (Hsinchu, TW); Hsu, You-Ming (Kaohsiung, TW), filed on October 4, 2012, was published online on July 8, 2014.

The assignee for this patent, patent number 8772644, is Chipbond Technology Corporation (Hsinchu, TW).

Reporters obtained the following quote from the background information supplied by the inventors: "A conventional capacitor is made to become a single package device in advance. Thereafter, soldering said packaged capacitor onto a printed circuit board (PCB) by using surface mounting technology (SMT). Or, connecting said packaged capacitor to interior traces of the flexible print board (FPC) by utilizing flip-chip bonding technology. With the breakthrough of integrated circuit process development, various kinds of electronic devices trend toward features of high density, high operation speed and miniaturization. Therefore, specific manufacturing method and installation manner for conventional capacitor require a relative lagging process and a larger space, which does not meet present requirement."

In addition to obtaining background information on this patent, VerticalNews editors also obtained the inventors' summary information for this patent: "The primary object of the present invention is to provide a carrier with three-dimensional capacitor including a substrate and at least one three-dimensional capacitor, wherein the substrate comprises a surface and at least one trace layer formed on the surface. The trace layer comprises at least one first terminal and at least one second terminal. The three-dimensional capacitor is integrally formed as one piece with the trace layer, wherein the three-dimensional capacitor and the trace layer are made of a same material. The three-dimensional capacitor comprises a first capacitance portion and a second capacitance portion having a polarity opposite to a polarity of the first capacitance portion, wherein the first capacitance portion comprises a first end, a second end, at least one first section, at least one second section connected to the first section and at least one first passage located between the first section and the second section. The second capacitance portion is formed at the first passage and comprises a third end, a fourth end, at least one third section, at least one fourth section connected to the third section and at least one second passage located between the third section and the fourth section. The second passage is in communication with the first passage, the first capacitance portion is located at the second passage, the first end corresponds to the third end and connects to the first terminal, the third end connects to the second terminal, wherein the first section and the third section are spaced apart from each other to define a first spacing, the third section and the second section are spaced apart from each other to define a second spacing, the fourth section and the second section are spaced apart from each other to define a third spacing. Accordingly, the three-dimensional capacitor possesses features of thinner and lighter owning to the reason that the three-dimensional capacitor is integrally formed as one piece with the trace layer. In addition, the step of soldering the capacitor onto the carrier can be ignored thereby simplifying the manufacturing process."

For more information, see this patent: Kuo, Chih-Ming; Ho, Lung-Hua; Hsu, You-Ming. Carrier with Three-Dimensional Capacitor. U.S. Patent Number 8772644, filed October 4, 2012, and published online on July 8, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8772644.PN.&OS=PN/8772644RS=PN/8772644

Keywords for this news article include: Chipbond Technology Corporation.

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Source: Journal of Technology


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