News Column

Patent Issued for Camera Module for Shielding EMI

July 23, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventor Kim, Yong-Gu (Seoul, KR), filed on July 13, 2011, was published online on July 8, 2014.

The patent's assignee for patent number 8773867 is Samsung Electro-Mechanics Co., Ltd. (Suwon-Si, Gyeonggi-Do, KR).

News editors obtained the following quote from the background information supplied by the inventors: "The present invention is related to a cameral module.

"When a camera module is installed in a main body of a mobile device, a shield is ordinarily introduced to shield electronic interference for electronic signals outputted from an image sensor or other electronic components.

"When the mobile device is assembled, a grounding part is separately arranged on an external side of the shield, and a grounding pad is formed on an upper surface of a printed circuit board, and the grounding part and the grounding pad are soldered to each other.

"However, it is difficult to find an appropriate amount of lead that is soldered. That is, in case there is an excessive amount of soldered lead, other components and parts may be damaged, and in case the space required for soldering is expanded in order to avoid such damage, the overall size of the camera module may be increased against the trend of making the overall camera module smaller. On the contrary, in case there is an insufficient amount of soldered lead, the grounding pad and the grounding part may not be properly grounded."

As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventor's summary information for this patent: "The present invention provides a camera module that can be soldered in a stable manner and can properly regulate a solder.

"The present invention also provides a camera module that can apply an efficient space for soldering.

"An aspect of the present invention features a camera module, which can include: a printed circuit board having a grounding pad formed on one surface thereof; a housing mounted on an upper side of the printed circuit board and including a lens inside thereof; a shield covering the housing in order to shield electromagnetic waves from an outside and having an opening cavity formed therein in correspondence with a location of the grounding pad; and a solder formed in the opening cavity and connecting the shield with the grounding pad.

"The shield can include: a shield body having a shape in which a lower side thereof is open; and a plurality of covers having a shape of protruding downwardly at a lower end part of the shield body.

"The plurality of covers can be separated from one another, and a space between the separated plurality of covers can form the opening cavity.

"The cover can be bent toward an outside so as to form an inner space for accommodating solder that is excessively injected.

"The opening cavity can be formed at a corner of the shield."

For additional information on this patent, see: Kim, Yong-Gu. Camera Module for Shielding EMI. U.S. Patent Number 8773867, filed July 13, 2011, and published online on July 8, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8773867.PN.&OS=PN/8773867RS=PN/8773867

Keywords for this news article include: Electronics, Circuit Board, Samsung Electro-Mechanics Co. Ltd.

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


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Source: Electronics Newsweekly


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