News Column

Patent Application Titled "Substrate Processing Device and Method of Manufacturing the Same" Published Online

July 23, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- According to news reporting originating from Washington, D.C., by VerticalNews journalists, a patent application by the inventors CHOI, Hyun Sik (Suwon-si, KR); LEE, Bong Yeol (Suwon-si, KR); YOON, Min Hee (Suwon-si, KR); KIM, Seung Chul (Suwon-si, KR), filed on December 30, 2013, was made available online on July 10, 2014.

The assignee for this patent application is Samsung Electro-Mechanics Co., Ltd.

Reporters obtained the following quote from the background information supplied by the inventors: "The present invention relates to a substrate processing device and a method of manufacturing the same.

"In general, a plurality of semiconductor chips are formed by performing various semiconductor processes on a semiconductor substrate. In order to mount each semiconductor chip on a printed circuit board, a semiconductor package is formed by performing a packaging process on the semiconductor chips.

"The semiconductor package includes a package substrate, a semiconductor chip mounted on the package substrate, a conductive connection member which electrically connects the semiconductor chip to the package substrate, a molding member formed on the package substrate to cover the semiconductor chip, and external connection terminals mounted on the package substrate.

"The conductive connection member includes a wire, a bump, and the like. The package having a structure in which the semiconductor chip is connected to the package substrate through the bump is a flip chip package. Prior to forming the bump on the package substrate, a process of applying a flux may be performed. The flux is to remove an oxide layer which is formed on the bump or the substrate (U.S. Pat. No. 6,598,779). The process of applying a flux may be classified into a method of applying the flux to the bump and a method of applying the flux to a connection pad of the package substrate. In this case, when the flux is excessively applied, a short between the fluxes applied to the adjacent connection pads may occur."

In addition to obtaining background information on this patent application, VerticalNews editors also obtained the inventors' summary information for this patent application: "The present invention has been made in an effort to provide a substrate processing device and a method of manufacturing the same capable of preventing a flux short or a bump short.

"According to a preferred embodiment of the present invention, there is provided a substrate processing device, including: a first mask disposed over a base substrate and provided with a first opening which exposes a connection pad of the base substrate; a first squeeze inserting a flux ball into a first opening of the first mask; and a first heating means heating a flux ball which is disposed on the connection pad.

"The flux ball may be in a solid state.

"The first mask may be a metal mask.

"The substrate processing device may further include: a second mask provided with a second opening disposed at a position corresponding to an upper portion of the connection pad.

"A solder ball may be inserted into the second opening of the second mask.

"The substrate processing device may further include: a second squeeze inserting the solder ball into the second opening of the second mask.

"The substrate processing device may further include: a second heating means heating the solder ball.

"According to another preferred embodiment of the present invention, there is provided a method of manufacturing a substrate, including: preparing a base substrate provided with a connection pad; forming a first mask including a first opening exposing the connection pad over the base substrate; inserting the flux ball into the first opening of the first mask; and heating the flux ball.

"The flux ball may be in a solid state.

"The first mask may be a metal mask.

"In the inserting of the flux ball into the first opening of the first mask, the flux ball may be inserted into the first opening by using a first squeeze.

"The method of manufacturing a substrate may further include: after the inserting of the flux ball into the first opening of the first mask, removing the first mask.

"The method of manufacturing a substrate may further include: after the heating of the flux ball, disposing the solder ball over the heated flux ball.

"The disposing of the solder ball may include: forming a second mask, which is provided with the second opening disposed at a position corresponding to an upper portion of the connection pad, over the base substrate; and inserting the solder ball into the second opening of the second mask.

"In the inserting of the solder ball into the second opening of the second mask, the solder ball may be inserted into the second opening by using a second squeeze.

"The method of manufacturing a substrate may further include: after the inserting of the solder ball into the second opening of the second mask, removing the second mask.

"The method of manufacturing a substrate may further include: after the inserting of the solder ball into the second opening of the second mask, heating the solder ball to form a bump.

"The method of manufacturing a substrate may further include: after the forming of the bump, removing a flux remaining on the base substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

"The above and other objects, features and advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

"FIG. 1 is an exemplified diagram illustrating a substrate processing device according to a preferred embodiment of the present invention;

"FIG. 2 is an exemplified diagram illustrating a substrate processing device according to another preferred embodiment of the present invention; and

"FIGS. 3 to 10 are exemplified diagrams illustrating a method of manufacturing a substrate according to another preferred embodiment of the present invention."

For more information, see this patent application: CHOI, Hyun Sik; LEE, Bong Yeol; YOON, Min Hee; KIM, Seung Chul. Substrate Processing Device and Method of Manufacturing the Same. Filed December 30, 2013 and posted July 10, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=6673&p=134&f=G&l=50&d=PG01&S1=20140703.PD.&OS=PD/20140703&RS=PD/20140703

Keywords for this news article include: Electronics, Semiconductor, Samsung Electro-Mechanics Co. Ltd..

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Source: Electronics Newsweekly


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