News Column

International Business Machines, Toshiba America Electronic Components Assigned Patent

July 14, 2014



By Targeted News Service

ALEXANDRIA, Va., July 14 -- International Business Machines, Armonk, New York, and Toshiba America Electronic Components, Irvine, California, have been assigned a patent (8,772,942) developed by four co-inventors for an "interconnect structure employing a Mn-group VIIIB alloy liner." The co-inventors are Daniel C. Edelstein, Yorktown Heights, New York, Takeshi Nogami, Albany, New York, Kazumichi Tsumura, Guilderland, New York, and Takamasa Usui, Selkirk, New York.

The patent application was filed on Jan. 26, 2010 (12/693,637). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8,772,942.PN.&OS=PN/8,772,942&RS=PN/8,772,942

Written by Deviprasad Jena; edited by Jaya Anand.

DJ0714JA0714-1034947


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Source: Targeted News Service


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