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Orbotech Presents Advanced Production Tools for the Japanese PCB Market at the JPCA 44th International Electronic Circuits Exhibition

June 6, 2014



ENP Newswire - 06 June 2014

Release date- 03062014 - Tokyo, Japan - Orbotech Japan Co. Ltd., the Japanese subsidiary of Orbotech Ltd., a leading global provider of yield-enhancing and production solutions for printed circuit boards (PCBs) and IC substrates, is demonstrating its latest solutions for advanced PCB manufacturing at the JPCA Show 2014 (The 44th International Electronic Circuits Exhibition) in No.3K-04, East Hall 3.

'We continue to supply the Japanese PCB industry with our industry-leading innovative production solutions, enabling our customers to gain a serious advantage in the market,' says Mr. Chiharu Aono, President of Orbotech Japan Co. Ltd. 'At the JPCA show this year, Orbotech is presenting a range of high-end systems developed to meet the demanding needs of the industry's most advanced applications.'

The JPCA 2014 show will mark the introduction of Orbotech's newest AOI system for advanced IC substrate production to the Japanese market. The Ultra Fusion 600 features powerful Multi-Image Technology with specially-designed 3-D illumination for ultra-fine detection accuracy down to 5-microm. The Ultra Fusion 600 utilizes an innovative optical head, specially designed to accommodate the increasingly complex requirements of semi-additive processes and flip-chip structures. Notably, this system achieves a major reduction in false alarms by providing greater inspection clarity for complex designs and micro defect detection capabilities to correctly identify fine and critical shallow shorts.

Orbotech will be showcasing its flagship LDI system, the Paragon- Xpress 50, for mass production digital imaging of fine-line, HDI, flex and rigid-flex applications as well as its flagship AOR system, Ultra PerFix 120, for repairing shorts and excess copper defects down to 10-microm resolution on advanced IC substrates.

The latest developments from Frontline PCB Solutions, the leading provider of CAM systems for HDI and advanced IC packaging will also be demonstrated. New and improved systems on display include the improved InCAM and InSight PCB, and the fast and accurate web-based pre-CAM solution.

About Orbotech Ltd.

Orbotech Ltd. (NASDAQ/GSM: ORBK) has been at the cutting edge of the electronics industry supply chain, as an innovator of enabling technologies used in the manufacture of the world's most sophisticated consumer and industrial products, for over 30 years. The Company is a leading provider of yield-enhancing and production solutions, primarily for manufacturers of printed circuit boards, flat panel displays and other electronic components; and today, virtually every electronic device is produced using Orbotech technology. The Company also applies its core expertise and resources in other advanced technology areas, including character recognition for check and forms processing and solar photovoltaic manufacturing. Headquartered in Israel and operating from multiple locations internationally, Orbotech's highly talented and inter-disciplinary professionals design, manufacture, sell and service the Company's end-to-end portfolio of solutions for the benefit of customers the world over. For more information please see the Company's filings with the U.S. Securities and Exchange Commission at www.sec.gov and visit the Company's corporate website at www.orbotech.com. The corporate website is not incorporated herein by reference and is included as an inactive textual reference only.

Company Contact:

Ella Vainberg

PCB Marketing Communications Manager

Orbotech Ltd.

Tel: +972-8-942-3194

ella.vainberg@orbotech.com


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Source: ENP Newswire


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