This patent application is assigned to
The following quote was obtained by the news editors from the background information supplied by the inventors: "The present invention generally relates to integrated circuit packaging, and, more specifically, to processing module packaging.
"Integrated circuit (IC) fabrication is a multi-step sequence which includes processes such as patterning, deposition, etching, and metallization. Typically, in the final processing steps, the resulting IC die are separated and packaged. IC packaging serves several purposes, including providing an electrical interface with the die, providing a thermal medium through which heat may be removed from the die, and/or providing mechanical protection for the die during subsequent usage and handling.
"One type of IC packaging technique is referred to as 'flip chip' packaging. In flip chip packaging, after the metallization process is complete, solder bump structures (e.g., solder balls, pads, etc.) are deposited on the die, and the die is separated from the wafer (e.g., via dicing, cutting, etc.). The die is then inverted and positioned on a substrate so that the solder bumps align with electrical connections formed on the substrate. Heat is applied via a solder reflow process to re-melt the solder bumps and attach the die to the substrate. The die/substrate assembly may further be underfilled with a non-conductive adhesive to strengthen the mechanical connection between the die and the substrate.
"Over the past decade, datacenters have experienced unprecedented growth as the popularity of Internet-related products and services has increased. However, as providers seek to further increase the processing and storage capacities of datacenters and servers, they confront many obstacles, including increased power consumption and thermal management requirements. Moreover, such datacenters may include tens of thousands of processors and memory devices, each of which must be provided with proper electrical connections and sufficient heat removal. Thus, as the scale of datacenters continues to increase, the complexity, size, and thermal requirements of server components is quickly becoming a limiting factor.
"Accordingly, there is a need in the art for a more effective way of providing server component packaging."
In addition to the background information obtained for this patent application, VerticalNews journalists also obtained the inventor's summary information for this patent application: "One embodiment of the present invention sets forth a processing module including an interposer and a plurality of processing nodes. The interposer includes a plurality of through substrate vias. Each processing node includes a processing unit die coupled directly to a top surface of the interposer with a first plurality of solder bump structures, a memory die coupled directly to the top surface of the interposer with a second plurality of solder bump structures, and a plurality of circuit elements electrically coupling the processing unit die and the memory die. The processing module further includes a plurality of electrical connections formed on a bottom surface of the interposer and electrically coupled to the plurality of processing nodes through the plurality of through substrate vias. The processing module further comprises a plurality of interconnecting circuit elements electrically interconnecting the plurality of processing nodes.
"Further embodiments provide a method of fabricating a processing module.
"One advantage of the disclosed technique is that a plurality of processing nodes may be disposed on a single interposer wafer, simplifying the fabrication and packaging processes, streamlining thermal management, and allowing a greater number of processing and memory die to be included in a smaller processing module.
BRIEF DESCRIPTION OF THE DRAWINGS
"So that the manner in which the above recited features of the invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
"FIG. 1 is a block diagram illustrating a processing system configured to implement one or more aspects of the present invention;
"FIGS. 2A and 2B illustrate schematic views of a conventional processing module having a conventional configuration;
"FIGS. 3A-3C illustrate schematic views of a processing module having aspects of the present invention;
"FIGS. 4A and 4B illustrate schematic views of the processing module of
"FIGS. 3A and 3B having aspects of the present invention;
"FIGS. 5A and 5B illustrate a schematic view of the interposer of the processing module of FIGS. 4A and 4B having aspects of the present invention; and
"FIG. 6 is a flow diagram of methods steps for fabricating a processing module, according to one embodiment of the present invention."
URL and more information on this patent application, see: Yee, Abraham F. Server Processing Module. Filed
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