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Researchers Submit Patent Application, "Method for Electrodepositing Copper Nanoparticles", for Approval

June 12, 2014



By a News Reporter-Staff News Editor at Politics & Government Week -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors YANG, Chia-Jung (Kaohsiung City, TW); LU, Fu-Hsing (Taichung City, TW), filed on February 7, 2013, was made available online on May 29, 2014.

The patent's assignee is National Chung Hsing University.

News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates generally to a preparation method of nano-metal and more particularly, to a method for electrodepositing copper nanoparticles.

"Copper nanoparticles are widely used in various kinds of fields. For example, copper nanoparticles can be used in the application field of catalyst, conductive metal ink, or detector material. During the process of preparing copper nanoparticles, it is important to control the surface morphology of the copper nanoparticles such that the copper nanoparticles can have well-defined and homogeneous physical and chemical properties.

"A prior art using electrodepositing method to form copper nanoparticles on a conductive polymer was developed and used. However, because the conductive polymer has poor anti-corrosion characteristic, the applicable scope of the aforesaid prior art is limited. Besides, among the electrodepositing methods for forming copper nanoparticles, a method of adjusting pH value or temperature of electrolyte solution was adopted for controlling the surface morphology of copper nanoparticles. However, it is unfriendly to the environment to use acidic, basic or organic solution to adjust pH value of electrolyte solution, and it may waste a lot of energy to adjust temperature of electrolyte solution. Therefore, it is desired to have a method that can well control the surface morphology of copper nanoparticles but has no disadvantages mentioned above."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "It is therefore one objective of the present invention to provide a preparation method of copper nanoparticles, which has widely applicable scope.

"It is another objective of the present invention to provide a preparation method of copper nanoparticles, which can control the surface morphology of copper nanoparticles without adjusting pH value or temperature of electrolyte solution.

"In order to achieve the aforesaid objectives, the method for electrodepositing copper nanoparticles of the present invention includes the steps of:

"a) providing a reaction system having an electrolyte solution, a conductive nitride film used as a working electrode and immersed in the electrolyte solution, a copper metal or a copper alloy used as an auxiliary electrode and immersed in the electrolyte solution, and a reference electrode immersed in the electrolyte solution; and

"b) applying pulse voltage to the reaction system to form copper nanoparticles on a surface of the conductive nitride film.

"Because the surface morphology and directionality of the conductive nitride film used as the working electrode of the present invention can be adjusted and the conductive nitride film has a superior anti-corrosion characteristic, the working electrode of the present invention has widely applicable scope than a general electrode. In comparison with the prior electrodepositing methods, which should be proceeded in acidic, basic or organic electrolyte solution for controlling the surface morphology of copper nanoparticles, the electrodepositing method provided by the present invention can be proceeded at room temperature and in neutral electrolyte solution to form copper nanoparticles having different surface morphology on the surface of the conductive nitride film having different surface roughness. Therefore, the electrodepositing method of the present invention is more friendly to the environment.

BRIEF DESCRIPTION OF THE DRAWINGS

"The present invention will become more fully understood from the detailed description given herein below and the accompanying drawings which are given by way of illustration only, and thus are not limitative of the present invention, and wherein:

"FIG. 1 is a schematic diagram showing a reaction system for performing the method of the present invention;

"FIG. 2 is a SEM micrograph of titanium nitride film used in the first embodiment of the present invention, showing the surface morphology thereof;

"FIG. 3 is X-ray diffraction patterns of titanium nitride film before and after the electrodeposition according to the method of the first embodiment of the present invention;

"FIG. 4 is a first SEM micrograph of copper nanoparticles formed in accordance with the first embodiment of the present invention, showing the surface morphology thereof;

"FIG. 5 is a second SEM micrograph of copper nanoparticles formed in accordance with the first embodiment of the present invention, showing the surface morphology thereof;

"FIG. 6 is a SEM micrograph of titanium nitride film used in the second embodiment of the present invention, showing the surface morphology thereof;

"FIG. 7 is X-ray diffraction patterns of titanium nitride film before and after the electrodeposition according to the method of the second embodiment of the present invention;

"FIG. 8 is a first SEM micrograph of copper nanoparticles formed in accordance with the second embodiment of the present invention, showing the surface morphology thereof; and

"FIG. 9 is a second SEM micrograph of copper nanoparticles formed in accordance with the second embodiment of the present invention, showing the surface morphology thereof."

For additional information on this patent application, see: YANG, Chia-Jung; LU, Fu-Hsing. Method for Electrodepositing Copper Nanoparticles. Filed February 7, 2013 and posted May 29, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=5673&p=114&f=G&l=50&d=PG01&S1=20140522.PD.&OS=PD/20140522&RS=PD/20140522

Keywords for this news article include: Chemistry, Electrolytes, Light Metals, Nanoparticle, Nanotechnology, Titanium Nitride, Inorganic Chemicals, Emerging Technologies, National Chung Hsing University.

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Source: Politics & Government Week


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