News Column

Researchers Submit Patent Application, "Semiconductor Module and Method of Manufacturing the Same", for Approval

July 3, 2014



By a News Reporter-Staff News Editor at Politics & Government Week -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors SOHN, Young Ho (Suwon, KR); JO, Eun Jung (Suwon, KR); LIM, Jae Hyun (Suwon, KR); KIM, Tae Hyun (Suwon, KR), filed on December 4, 2013, was made available online on June 19, 2014.

The patent's assignee is Samsung Electro-mechanics Co., Ltd.

News editors obtained the following quote from the background information supplied by the inventors: "The present disclosure relates to a semiconductor module and a method of manufacturing the same, and more particularly, to a power semiconductor module capable of being easily manufactured, and a method of manufacturing the same.

"Recently, demand for portable electronic products has rapidly increased. In order to satisfy this demand, it has been necessary to decrease the sizes and weights of electronic components mounted in such portable electronic products.

"Therefore, in addition to a method of decreasing sizes of electronic components themselves, a method of installing as many devices and conductive wires as possible in a defined space has been important in designing a semiconductor module.

"Meanwhile, at the time of driving a power semiconductor device, a large amount of heat may be generated. Since this heat has an effect on a lifespan and operations of the electronic product, it has been important to radiate the heat of the semiconductor module.

"To this end, a power semiconductor module according to the related art has a structure in which both a power device and a control device are mounted on one surface of a circuit board and a heat radiating plate is mounted on the other surface of the circuit board.

"However, the power semiconductor module according to the related art as described above may have the following problems.

"First, the number of semiconductor devices mounted in the same space is increased due to miniaturization of the power semiconductor module, such that a large amount of heat may be generated in the power semiconductor module. However, the heat radiating plate is only disposed on a lower surface of the power semiconductor module, such that heat may not be efficiently radiated thereby.

"In addition, the power semiconductor module according to the related art has a disadvantage in that a size thereof may be increased, since the devices are disposed on a single surface of the circuit board.

"Further, devices provided in the power semiconductor module according to the related art or the devices and external connection terminals are generally connected to each other by a wire bonding scheme. Therefore, time required for a manufacturing process is increased due to the wire bonding. In addition, bonding wires may be deformed and damaged due to physical pressure applied to the bonding wires in a process of manufacturing the power semiconductor module and delamination may be generated in a position in which the bonding wires and the devices are bonded to each other due to heat generated at the time of driving the semiconductor module, such that reliability may be decreased at the time of using the power semiconductor module for a long period of time.

"Therefore, a power semiconductor module having excellent heat radiation characteristics, being able to be easily manufactured and having reliability secured therein has been demanded."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "An aspect of the present disclosure may provide a power semiconductor module having excellent heat radiation characteristics, and a method of manufacturing the same.

"Another aspect of the present disclosure may provide a power semiconductor module that does not use a bonding wire, and a method of manufacturing the same.

"Another aspect of the present disclosure may provide a power semiconductor module able to be easily manufactured, and a method of manufacturing the same.

"According to an aspect of the present disclosure, a semiconductor module may include: a control part including at least one control device; and a power part including at least one power device, wherein any one of the control part and the power part includes contact pins having elasticity, and the control part and the power part are electrically connected to each other by the contact pins.

"The control part may include at least one control module substrate having the control device mounted on one surface thereof, and the contact pin may be mounted on the other surface of the control module substrate.

"The control part may further include a housing accommodating the control module substrate and the control device therein, and the contact pin may protrude outwardly while penetrating through the housing.

"The control part may include two control module substrates, wherein the two control module substrates are coupled to each other so that surfaces thereof on which the control devices are mounted face each other.

"The control part may further include at least one spacer interposed between the two control module substrates to maintain an interval between the two control module substrates.

"The control part may further include a connecting part disposed on one side of the control module substrate and electrically connected to the exterior.

"The power part may include: at least one power module substrate having the power device mounted on one surface thereof; and a frame disposed on one surface of the power module substrate along an edge of the power module substrate to form a thickness of the power part.

"The power part may further include at least one contact pad formed on one surface of the power module substrate or an outer surface of the power device and contacting the contact pins.

"The semiconductor module may further include: a case accommodating the control part and the power part therein; and at least one heat radiating part fastened to an outer surface of the case.

"The case may include: a first accommodating part having the power part coupled thereto while being inserted thereinto in a sliding scheme; and a second accommodating part having the control part accommodated therein.

"The first and second accommodating parts may have an opened part formed therebetween, and the power part may be coupled to the first accommodating part so that the power device faces the control part through the opened part.

"According to another aspect of the present disclosure, a semiconductor module may include: a control part including a plurality of contact pins protruding on both sides thereof; and two power parts disposed on both sides of the control part, respectively, wherein the power parts are electrically connected to the control part while contacting the contact pins.

"According to another aspect of the present disclosure, a method of manufacturing a semiconductor module may include: preparing a control part including a plurality of contact pins protruding on both sides thereof; disposing power parts on both sides of the control part, respectively; and fixedly coupling the power parts and the control part to each other while closely adhering the power parts and the control part to each other so that the power parts contact the contact pins.

"The preparing of the control part may include preparing two control module substrates having control devices mounted on one surfaces thereof and the contact pins mounted on the other surface thereof and coupling the two control module substrates to each other so that surfaces thereof on which the contact pins are mounted are directed to the exterior.

"The disposing of the power parts may include inserting the power parts into upper and lower cases in a sliding scheme, respectively.

"The fixed coupling of the power parts and the control part may include coupling and fixing the upper and lower cases to each other so that the control part is accommodated in a space formed by the upper and lower cases.

"The method may further include fastening at least one heat radiating part to outer surfaces of the upper and lower cases.

BRIEF DESCRIPTION OF DRAWINGS

"The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

"FIG. 1 is a perspective view schematically illustrating a semiconductor module according to an exemplary embodiment of the present disclosure;

"FIG. 2 is a cross-sectional view of the semiconductor module taken along line A-A' of FIG. 1;

"FIG. 3 is an exploded perspective view of the semiconductor module shown in FIG. 2;

"FIG. 4 is a plan view of a power part taken along line B-B' of FIG. 3;

"FIGS. 5 and 6 are plan views of a control part taken along line C-C' of FIG. 3; and

"FIG. 7 is a plan view of the control part taken along line D-D' of FIG. 3."

For additional information on this patent application, see: SOHN, Young Ho; JO, Eun Jung; LIM, Jae Hyun; KIM, Tae Hyun. Semiconductor Module and Method of Manufacturing the Same. Filed December 4, 2013 and posted June 19, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=4559&p=92&f=G&l=50&d=PG01&S1=20140612.PD.&OS=PD/20140612&RS=PD/20140612

Keywords for this news article include: Circuit Board, Semiconductor, Electronic Components, Samsung Electro-mechanics Co. Ltd..

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


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Source: Politics & Government Week


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