The patent's assignee is
News editors obtained the following quote from the background information supplied by the inventors: "This application claims priority from previously filed Taiwan Patent Application No.101146337 filed on
"The present disclosure relates to a method of making a light-emitting device and in particular to a method of etching a protective layer.
"The light-emitting diodes (LEDs) of the solid-state lighting elements have the characteristics of the low power consumption, low heat generation, long operational life, shockproof, small volume, quick response and good opto-electrical property like light emission with a stable wavelength so the LEDs have been widely used in household appliances, indicator light of instruments, and opto-electrical products, etc.
"Generally speaking, the method of making a light-emitting diode comprises many lithography processes and each of the processes comprises complicated steps. How to reduce the steps of processes and decrease the cost is an important issue.
"Besides, light-emitting diodes can be further combined with a sub-mount to form a light emitting device, such as a bulb. The light-emitting device comprises a sub-mount with circuit; a solder on the sub-mount fixing the light-emitting diode on the sub-mount and electrically connecting the base of the light-emitting diode and the circuit of the sub-mount; and an electrical connection structure electrically connecting the electrode pad of the light-emitting diode and the circuit of the sub-mount; wherein the above sub-mount can be a lead frame or a large size mounting substrate for designing circuit of the light-emitting device and improving its heat dissipation."
As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "A method of manufacturing a light-emitting device comprises: forming a light-emitting structure on a substrate, the light-emitting structure having an active layer; forming a protective layer on the light-emitting structure, the protective layer having a first thickness; etching the protective layer such that the protective layer has a second thickness less than the first thickness; and patterning the protective layer.
BRIEF DESCRIPTION OF THE DRAWINGS
"FIGS. 1A-1H show a cross-sectional view of a method of manufacturing a light-emitting device in accordance with an embodiment of the present disclosure.
"FIG. 2A shows a light-emitting device in accordance with an embodiment according to the manufacturing method of the present disclosure.
"FIG. 2B shows a partial enlarged drawing of FIG. 2A.
"FIGS. 3A-3C show top views of light-emitting devices in accordance with embodiments of the present disclosure.
"FIG. 4 shows an exploded drawing of a bulb in accordance with an embodiment of the present disclosure."
For additional information on this patent application, see: Wu, Jar-Yu; Su, Ching-Jang; Tseng, Chun-Lung; Shen, Ching-Hsing. Method of Making a Light Emitting Device and Light Emitting Device Made Thereof. Filed
Keywords for this news article include: Electronics,
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