News Column

Huawei Launched Honor 6, HiSilicon Debuted

June 25, 2014



SHENZHEN, June 25, SinoCast -- Huawei Technologies held a release conference of a new mobile phone Honor 6 on June 24, at which HiSilicon Technologies, formally known as ASIC Design Center of Huawei, made a grand debut.

Honor 6 adopts chip Kirin920 supplied by HiSilicon, which is the first eight-core LTE Cat6 mobile phone chip entering commercial use, adopts a 28-nano technology and owns 300M topspeed communication ability.

Huawei is said to invest in chip manufacturing through HiSilicon with a purpose to increase research and development of chips and form the most core competitiveness for the future.


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Source: Sinocast Computers & Electronics Beat (China)


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