News Column

Researchers Submit Patent Application, "Socket and Electronic Component Mounting Structure", for Approval

June 26, 2014



By a News Reporter-Staff News Editor at Politics & Government Week -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors Masuda, Yasushi (Kawasaki, JP); Tamura, Akira (Yokohama, JP); Morita, Yoshihiro (Yokohama, JP); Ohsawa, Satoshi (Kawasaki, JP), filed on November 25, 2013, was made available online on June 12, 2014.

The patent's assignee is Fujitsu Limited.

News editors obtained the following quote from the background information supplied by the inventors: "In a structure in which an electronic component is mounted on a board, a structure in which a socket is interposed between the board and the electronic component is sometimes used.

"For example, a structure is known in which contact pins electrically connected to an electronic component and contact pins not electrically connected to the electronic component pass through receiving holes formed in a heat spreader on a socket main body, and a new heat radiation pathway is thereby formed.

"A related art is disclosed in Japanese Laid-open Patent Publication No. 2008-111722."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "According to an aspect of the invention, a socket includes a plurality of coupling members that each include a first end portion and a second end portion, the coupling members being made of electrically conductive material, wherein a terminal of an electronic component and a terminal of a board are electrically coupled with the first end portion and the second end portion, respectively, so to electrically connect the terminal of the electronic component and the terminal of the board, a holding member that holds the plurality of coupling members in such a manner that the plurality of coupling members are not in contact with each other, the holding member being made form an electrical insulating material, and a sheet member that is in contact with the electronic component and the board in parts between the plurality of coupling members, the sheet member being made from a material which is electrical insulating and thermal diffusive.

"The object and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the claims.

"It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, as claimed.

BRIEF DESCRIPTION OF DRAWINGS

"FIG. 1 is a perspective view illustrating a socket of a first embodiment;

"FIG. 2 is a partial enlarged perspective view illustrating the socket of the first embodiment;

"FIG. 3 is a sectional view illustrating an electronic component mounting structure of the first embodiment using a section of the socket taken along line III-III in FIG. 2;

"FIG. 4 is a sectional view taken along line IV-IV in FIG. 2 illustrating the socket of the first embodiment;

"FIG. 5 is a partial enlarged perspective view illustrating a holding member and coupling members of the socket of the first embodiment;

"FIG. 6 is a partial enlarged perspective view illustrating a unitary sheet of the socket of the first embodiment;

"FIG. 7 is a sectional view illustrating the socket of the first embodiment in the process of manufacturing using the same section as FIG. 4;

"FIG. 8 is a sectional view taken along line VIII-VIII in FIG. 2 illustrating the socket of the first embodiment;

"FIG. 9 is a sectional view illustrating an embodiment of the electronic component mounting structure using the socket of the first embodiment using the same section of the socket as FIG. 4;

"FIG. 10 is a sectional view illustrating the electronic component mounting structure of the embodiment using the same section of the socket as FIG. 8;

"FIG. 11 is a perspective view illustrating the socket of the first embodiment housed within a frame body;

"FIG. 12 is a sectional view illustrating the electronic component mounting structure of the embodiment with the electronic component warped; and

"FIG. 13 is a sectional view illustrating the electronic component mounting structure of the embodiment with the electronic component warped."

For additional information on this patent application, see: Masuda, Yasushi; Tamura, Akira; Morita, Yoshihiro; Ohsawa, Satoshi. Socket and Electronic Component Mounting Structure. Filed November 25, 2013 and posted June 12, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=2547&p=51&f=G&l=50&d=PG01&S1=20140605.PD.&OS=PD/20140605&RS=PD/20140605

Keywords for this news article include: Fujitsu Limited.

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Source: Politics & Government Week


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