News Column

Researchers Submit Patent Application, "Semiconductor Package Including a Heat-Spreading Part and Method for Its Manufacture", for Approval

June 25, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventor KIM, DONG-KWAN (Hwaseong-si, KR), filed on November 4, 2013, was made available online on June 12, 2014.

No assignee for this patent application has been made.

News editors obtained the following quote from the background information supplied by the inventors: "Embodiments of the inventive concept relate to a semiconductor package including a heat-spreading part in which a thermal conductive film and a heat slug each of uniform thickness across their planar extent are integrated together.

"Recently, mobile products have come to require a semiconductor package characterized by their uniform thin-ness. Thus, various thermal spreading parts capable not only of enabling a uniformly thin semiconductor package to be manufactured but also of maximizing heat radiation efficiency have been suggested."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventor's summary information for this patent application: "Embodiments of the inventive concept provide a semiconductor package having a uniformly thin thickness.

"Embodiments of the inventive concept also provide a semiconductor package including a heat-spreading part having high thermal conductivity.

"Embodiments of the inventive concept also provide a semiconductor package including a thermal spreading part in which a thermal conductive film and a heat slug are integrated together.

"Embodiments of the inventive concept also provide a method of manufacturing such a semiconductor package by disposing an integral and relatively thin heat-spreading part characterized by uniform thickness (the heat-spreading part integrally vertically stacking and adhering a planar thermal conductive heat plug on a thin planar thermal conductive film) on an upper planar surface of a substrate-mounted semiconductor chip and an upper co-planar surface of a molding material surrounding at least lateral sides of the semiconductor chip, thereby producing a semiconductor package characterized by less thickness, more thermal radiation efficiency, and greater durability (e.g. against a known peeling-off phenomenon), all by way of reduced processing time (e.g. against additionally applying a heat emission material) and thus at lower cost.

"The technical objectives of the inventive concept are not limited to the above disclosure; other objectives may become apparent to those of ordinary skill in the art based on the following descriptions.

"In accordance with an aspect of the inventive concept, a semiconductor package includes a substrate, a semiconductor chip attached to an upper surface of the substrate, a molding material configured to surround side surfaces of the semiconductor chip, and a heat-spreading part disposed on the semiconductor chip. The heat-spreading part includes a heat slug and a thermal conductive film, the horizontal areas of which are substantially the same if not identical.

"A surface of the thermal conductive film that is not attached to the heat slug may be attached to upper surfaces of the semiconductor chip and the molding material. The thermal conductive film and the heat slug may have the same size.

"Corresponding side surfaces of the heat-spreading part, of the molding material and of the substrate may be vertically aligned with one another.

"Corresponding side surfaces of the heat-spreading part and of a portion of the molding material adjacent to the heat-spreading part may be aligned with each other in a first vertical direction (i.e. a first vertical plane). Corresponding side surfaces of a remaining portion of the molding material and of the substrate adjacent to the remaining portion of the molding material may be aligned with each other in a second vertical direction (i.e. a second vertical plane). The side surfaces aligned in the first vertical direction and the side surfaces aligned in the second vertical direction may or may not be vertically aligned with each other.

BRIEF DESCRIPTION OF THE DRAWINGS

"The foregoing and other features and advantages of the inventive concepts will be apparent from the more particular description of exemplary embodiments of the inventive concepts, as illustrated in the accompanying drawings in which like reference characters refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the inventive concepts. In the drawings:

"FIG. 1A is a schematic side cross-sectional view of a semiconductor package in accordance with a first embodiment of the inventive concept;

"FIG. 1B is a schematic side cross-sectional view of a semiconductor package in accordance with a second embodiment of the inventive concept;

"FIG. 2A is a schematic side cross-sectional view of a semiconductor package in accordance with a third embodiment of the inventive concept;

"FIG. 2B is a schematic side cross-sectional view of a semiconductor package in accordance with a fourth embodiment of the inventive concept;

"FIG. 3 is a flowchart conceptually illustrating a method of manufacturing a semiconductor package in accordance with an embodiment of the inventive concept;

"FIGS. 4A to 4F are conceptual cross-sectional views illustrating a method of manufacturing a semiconductor package in accordance with a first embodiment of the inventive concept;

"FIG. 5 is a conceptual side cross-sectional view illustrating a method of manufacturing a semiconductor package in accordance with a second embodiment of the inventive concept;

"FIG. 6 is a conceptual side cross-sectional view illustrating a method of manufacturing a semiconductor package in accordance with a third embodiment of the inventive concept;

"FIG. 7 is a conceptual side cross-sectional view illustrating a method of manufacturing a semiconductor package in accordance with a fourth embodiment of the inventive concept;

"FIGS. 8A and 8B are conceptual side cross-sectional views illustrating methods of forming a semiconductor package in accordance with other embodiments of the inventive concept;

"FIG. 9 is a diagram conceptually illustrating a semiconductor module including a semiconductor package in accordance with an embodiment of the inventive concept;

"FIG. 10 is a block diagram conceptually illustrating an electronic system including a semiconductor package in accordance with an embodiment of the inventive concept;

"FIG. 11 is a block diagram conceptually illustrating an electronic system including a semiconductor package in accordance with another embodiment of the inventive concept; and

"FIG. 12 schematically illustrates a mobile wireless phone including a semiconductor package in accordance with an embodiment of the inventive concept."

For additional information on this patent application, see: KIM, DONG-KWAN. Semiconductor Package Including a Heat-Spreading Part and Method for Its Manufacture. Filed November 4, 2013 and posted June 12, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=5602&p=113&f=G&l=50&d=PG01&S1=20140605.PD.&OS=PD/20140605&RS=PD/20140605

Keywords for this news article include: Patents, Electronics, Semiconductor.

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


For more stories covering the world of technology, please see HispanicBusiness' Tech Channel



Source: Electronics Newsweekly


Story Tools






HispanicBusiness.com Facebook Linkedin Twitter RSS Feed Email Alerts & Newsletters