Patent number 8749151 is assigned to 4233999
The following quote was obtained by the news editors from the background information supplied by the inventors: "High resolution imaging on photoreceptive materials coated on to various substrates is used in manufacturing processes such as manufacture of semiconductor devices, printed circuit boards and offset printing. In such manufacturing processes, the photoreceptive material may be exposed in a manner such as to create a desired image that, when additional steps are taken, produces a usable differentiation in the photoreceptive material in the exposed areas and unexposed areas. This difference may then be used to advance the manufacturing process.
"As one example, in offset printing, metal plates used may have a surface which has been differentiated between areas that are hydrophobic and areas that are hydrophilic. The plates may then exposed to water. The hydrophobic areas repel water, hydrophilic areas do not. When the plate comes in contact with ink, the ink is taken up by the areas where there is no water. This pattern of ink may then be transferred indirectly to paper, thus generating a printed page.
"Methods of creating images on these substrates have evolved over the decades from projecting illuminated images through a lens onto a substrate to the use of lasers and complex expensive mechanism to scan the surface of the substrate. Common to all known imaging methods is that the speed is constrained if the solution is to be practical in terms of cost.
"Embodiments of the present disclosure provide a method for imaging that is high speed and cost effective.
"Embodiments of the present disclosure provide methods and apparatus to change or adapt the light source to the spectral sensitivity of the substrate.
"Furthermore, embodiments of the present disclosure provide methods and apparatus for transporting an imaging mechanism over the substrate in such a fashion as to provide the required precision, accuracy, and resolution for high speed resolution imaging.
"Embodiments of this disclosure additionally provide methods and apparatus of controlling the intensity of the light emitting diodes through the using of voltage and current characteristics.
"Embodiments of this disclosure also provide for the methods and apparatus to control each individual light in the monolithic light emitting diode array at a speed consistent with the overall imaging requirements."
In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventor's summary information for this patent: "In accordance with embodiments of this disclosure, methods and apparatus are provided to fabricate massive monolithic arrays of individually addressable light emitting diodes, assemble a plurality of such massive monolithic arrays of individually addressable light emitting diodes, control each individual light emitting diode, and to assemble the same in manner to achieve the accuracy and stability required for a massive number of individually controlled light emitting diodes that can then be focused using projection optics on to a photoreceptive surface. In addition methods and apparatus are provided to move the imaging system thus described relative to the photoreceptive surface in two axes orthogonal to each other thus exposing the photoreceptive surface.
"The methods describe herein ensure the accuracy of the pixels produced by the methods and apparatus as well as the density that results in the imaging speed and the quality demanded by imaging systems for the applications contemplated in embodiments of this disclosure."
URL and more information on this patent, see: Khalid, Najeeb. System for and Method of Providing High Resolution Images Using Monolithic Arrays of Light Emitting Diodes. U.S. Patent Number 8749151, filed
Keywords for this news article include: Electronics, 4233999
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