News Column

Patent Issued for Semiconductor Device and Optical Print Head

June 25, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- A patent by the inventors Ogihara, Mitsuhiko (Tokyo, JP); Sagimori, Tomohiko (Tokyo, JP); Sakuta, Masaaki (Tokyo, JP), filed on July 31, 2009, was published online on June 10, 2014, according to news reporting originating from Alexandria, Virginia, by VerticalNews correspondents.

Patent number 8748918 is assigned to Oki Data Corporation (Tokyo, JP).

The following quote was obtained by the news editors from the background information supplied by the inventors: "The present invention relates to a semiconductor device having a semiconductor element such as a light emitting diode (LED) formed of a semiconductor thin film, and also relates to an optical print head using such a semiconductor device.

"A semiconductor element (i.e., an LED or the like) generates heat during operation. A temperature rise of the semiconductor element influences characteristics and reliability of the semiconductor element, and therefore it is necessary to dissipate the heat generated by the semiconductor element to the outside. For example, Patent Document No. 1 discloses a surface-emission type LED device capable of dissipating the heat generated by the LED.

"In the surface-emission type LED device, the LED is formed on a sapphire substrate, and the sapphire substrate is bonded onto a diamond substrate via a bonding layer. The diamond substrate has high heat conductivity and high insulation property. The heat generated by the LED is conducted to the diamond substrate and is dissipated to the outside. Patent Document No. 1 discloses another surface-emission type LED device in which the LED is formed on the sapphire substrate, and electrodes of the LED (i.e., on an opposite side to the sapphire substrate) are bonded onto the diamond substrate via the bonding layer.

"Patent Document No. 1: Japanese Laid-Open Patent Publication No. 2002-329896

"However, there is a demand for further enhancing the heat dissipation property of the semiconductor device."

In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventors' summary information for this patent: "The present invention is intended to provide a semiconductor device having enhanced heat dissipation property, and to provide an optical print head using such a semiconductor device.

"The present invention provides a semiconductor device including a substrate. A diamond-like carbon film is formed on the substrate. A thin film is formed on the diamond-like carbon film, and the thin film has a thickness thinner than the diamond-like carbon. Further, a semiconductor thin film having a semiconductor element is bonded onto the thin film.

"Since the semiconductor thin film is bonded onto the diamond-like carbon film via the thin film, an attractive force is produced between facing surfaces of the semiconductor thin film and the thin film due to intermolecular force (more specifically, van der Waals force or hydrogen bonding force), so that strong bonding strength can be obtained. Further, since the thin film is thinner than the diamond-like carbon film, heat conduction from the semiconductor thin film to the diamond-like carbon film is promoted. Therefore, when a substrate is composed of material with high heat conductivity, the heat can be efficiently dissipated to the outside via the substrate.

"The present invention also provides an optical print head including the semiconductor device and an optical system that guides a light emitted by the light emitting element of the semiconductor device.

"Since the optical print head uses the semiconductor device, a compact and reliable optical print head exhibiting high light emission efficiency can be obtained.

"Further scope of applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific embodiments, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description."

URL and more information on this patent, see: Ogihara, Mitsuhiko; Sagimori, Tomohiko; Sakuta, Masaaki. Semiconductor Device and Optical Print Head. U.S. Patent Number 8748918, filed July 31, 2009, and published online on June 10, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8748918.PN.&OS=PN/8748918RS=PN/8748918

Keywords for this news article include: Electronics, Semiconductor, Oki Data Corporation.

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Source: Electronics Newsweekly


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