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Patent Issued for Semiconductor Chip Package Structure for Achieving Flip-Chip Type Electrical Connection without Using Wire-Bonding Process and...

June 25, 2014



Patent Issued for Semiconductor Chip Package Structure for Achieving Flip-Chip Type Electrical Connection without Using Wire-Bonding Process and Method for Making the Same

By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventors Wang, Bily (Hsinchu, TW); Yang, Hung-Chou (Hsinchu County, TW); Chang, Jeng-Ru (Hsinchu County, TW), filed on June 1, 2011, was published online on June 10, 2014.

The patent's assignee for patent number 8748209 is Harvatek Corporation (Hsinchu, TW).

News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a semiconductor chip package structure and a method for making the same, in particular, to a semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and a method for making the same.

"Referring to FIG. 1, a known LED package structure is packaged via a wire-bonding process. The known LED package structure includes a substrate 1a, an LED (light emitting diode) 2a disposed on the substrate, two wires 3a, and a phosphor resin body 4a.

"The LED 2a has a light-emitting surface 20a opposite to the substrate 1a. The LED 2a has a positive pole area 21a and a negative pole area 22a electrically connected to two corresponding positive and negative pole areas 11a, 12a of the substrate 1a via the two wires 3a respectively. Moreover, the LED 2a and the two wires 3a are covered with the phosphor resin body 4a for protecting the LED 2a.

"However, the method of the prior art not only increases manufacture time and cost, but also leads to uncertainty about the occurrence of bad electrical connections in the LED package structure of the prior art resulting from the wire-bonding process. Moreover, the two sides of the two wires 3a are respectively disposed on the positive and negative pole areas 21a, 22a. Hence, when the light source of the LED 2a is projected outwardly from the light-emitting surface 20a and through the phosphor resin body 4a, the two wires 3a would produce two shadow lines within the light emitted by the LED 2a and thus affect the LED's light-emitting efficiency."

As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventors' summary information for this patent: "In view of the aforementioned issues, the present invention provides a semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and a method for making the same. Because the semiconductor chip package structure of the present invention can achieve electrical connection without using a wire-bonding process, the present invention can omit the wire-bonding process and avoid bad electrical connection in the semiconductor chip package structure.

"To achieve the above-mentioned objectives, the present invention provides a semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process, including: a package unit, at least one semiconductor chip, a first insulative unit, a first conductive unit, a second insulative unit and a second conductive unit. The package unit has at least one receiving groove. The at least one semiconductor chip is received in the at least one receiving groove and has a plurality of conductive pads disposed on its top surface. The first insulative unit has at least one first insulative layer formed between the conductive pads in order to insulate the conductive pads from each other. The first conductive unit has a plurality of first conductive layers formed on the at least one first insulative layer and the package unit, and one side of each first conductive layer is electrically connected to the corresponding conductive pad. The second insulative unit has at least one second insulative layer formed between the first conductive layers in order to insulate the first conductive layers from each other. The second conductive unit has a plurality of second conductive layers respectively formed on the other opposite sides of the first conductive layers.

"To achieve the above-mentioned objectives, the present invention provides a method of making semiconductor chip package structures for achieving flip-chip type electrical connection without using wire-bonding process, including: providing at least two semiconductor chips, wherein each semiconductor chip has a plurality of conductive pads; forming at least one first insulative layer between the conductive pads in order to insulate the conductive pads from each other; arranging the at least two semiconductor chips on an adhesive polymeric substance, wherein the conductive pads face the adhesive polymeric substance; covering the at least two semiconductor chips with a package unit; overturning the package unit and removing the adhesive polymeric substance in order to expose the conductive pads; forming a plurality of first conductive layers on the at least one first insulative layer for respectively and electrically connecting to the conductive pads; forming a plurality of second insulative layers between the first conductive layers in order to insulate the first conductive layers from each other; respectively forming a plurality of second conductive layers on the first conductive layers for electrically connecting to the conductive pads; and forming the semiconductor chip package structures by cutting each second conductive layer, each first conductive layer and the package unit.

"Therefore, the semiconductor chip package structure of the present invention can achieve electrical connection without using a wire-bonding process, so that the present invention can omit the wire-bonding process and avoid bad electrical connection in the semiconductor chip package structure.

"In order to further understand the techniques, means and effects the present invention takes for achieving the prescribed objectives, the following detailed descriptions and appended drawings are hereby referred, such that, through which, the purposes, features and aspects of the present invention can be thoroughly and concretely appreciated; however, the appended drawings are merely provided for reference and illustration, without any intention to be used for limiting the present invention."

For additional information on this patent, see: Wang, Bily; Yang, Hung-Chou; Chang, Jeng-Ru. Semiconductor Chip Package Structure for Achieving Flip-Chip Type Electrical Connection without Using Wire-Bonding Process and Method for Making the Same. U.S. Patent Number 8748209, filed June 1, 2011, and published online on June 10, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8748209.PN.&OS=PN/8748209RS=PN/8748209

Keywords for this news article include: Electronics, Semiconductor, Harvatek Corporation.

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Source: Electronics Newsweekly


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