“Over the past few years, we’ve steadily expanded our device modeling platform through internal development and acquisition of key technologies,” said
Advanced Modeling Capabilities
The new software release features three advanced device modeling packages for Agilent’s DynaFET, BSIM6, and BSIM-CMG models.
BSIM6 is the industry-standard model for bulk MOSFETs, offering important improvements for analog/RF applications over its predecessor, BSIM4. BSIM-CMG is the industry-standard model for sub-20 nm 3-D FinFET technologies. Modeling solutions for both BSIM6 and BSIM-CMG in the 2014 release are designed to help the semiconductor industry understand and use these new technologies.
The DynaFET modeling package is based on internally developed technology and is an integral part of Agilent’s GaN HEMT characterization, modeling and simulation solution. The GaN HEMT modeling package provides a GUI-based turnkey solution for DynaFET model generation.
Using artificial neural networks for charge and current formulations, and incorporating trapping/de-trapping and self-heating effects, the time-domain DynaFET model is capable of fitting accurately to DC, linear and large-signal measurement data—all simultaneously. This allows a single model file to be used for the design of different applications under various bias conditions, all with accurate simulation results.
The 2014 device modeling and characterization software release also provides a number of new and enhanced features designed to noticeably improve productivity across the end-to-end work flow of device characterization, model generation and model validation. These enhancements include:
U.S. Pricing and Availability
Agilent’s 2014 device modeling and characterization software release will be available in July.
More information on the 2014 release of IC-CAP, MBD and MQA software is available at www.agilent.com/find/eesof-iccap, www.agilent.com/find/eesof-mbp and www.agilent.com/find/eesof-mqa, respectively. Images of the software are available at www.agilent.com/find/DeviceModeling_2014_images.
Agilent IC-CAP software is a device-modeling program that delivers powerful characterization and analysis capabilities for today’s semiconductor modeling processes. Providing efficient and accurate extraction of active device and circuit model parameters, IC-CAP performs numerous modeling tasks, including instrument control, data acquisition, graphical analysis, simulation and optimization. It is used by semiconductor foundries and design houses to characterize foundry processes. For more information on IC-CAP, visit www.agilent.com/find/eesof-iccap.
Model Builder Program (MBP) is a one-stop solution that provides both automation and flexibility for high-volume, high-throughput device modeling. MBP includes powerful, built-in characterization and modeling capabilities as well as an open interface for modeling strategy customization. It is widely used both by semiconductor foundries and design houses to extract and customize SPICE model libraries. For more information, visit www.agilent.com/find/eesof-mbp.
Model Quality Assurance (MQA) provides the complete solution and framework to fabless design companies, IDMs and foundries for SPICE model library validation, comparison, and documentation. MQA has become a de facto industry-standard SPICE model QA tool. MQA performs model QA, comparison, and documentation automatically to ensure design success using advanced process technologies. For more information about MQA, visit www.agilent.com/find/eesof-mqa.
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