- Highly Integrated Lowest Power Chipset for Mobile 3D HMD and
The RDP501H provides HD (high definition, 1280 x 720p) resolution with .5” LCoS (Liquid Crystal On Silicon) panel, which is the industry’s first micro-display panel with an integrated light source driver circuit.
The RDC100 controller, stacked with DDR SDRAM and Flash memory for video frame buffer in a small 8mm x 8mm package, delivers 3D HD video data to two RDP501H panels which makes the chipset the best combination for portable and mobile 3D HMD devices in terms of bill of material cost and device form factor.
“Recent advances in smart glasses technology have enabled brilliant wearable devices in terms of mobility, user experience, and etc. Each device, however, has many trade-offs on screen resolution, battery life, and mobility. Most Smart Glasses have sacrificed display resolution for mobility and the latest HMD (head mounted display) device for entertainment market have the HD resolution display but with almost no mobility,” said
RAONTECH is sampling its HD micro-display chipset with HMD optic modules to selected customers.
RAONTECH is a leading semiconductor manufacturer in the mobile industry using its proprietary RF and System-on-a-Chip technology. RAONTECH’s patented low power technologies have enabled space saving and long lasting mobile devices with its low power chipset which has been adopted to world major mobile phone players. The company is headquartered in
Source: RAONTECH, INC.