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Researchers Submit Patent Application, "Wiring Board with Built-In Electronic Component and Method for Manufacturing Wiring Board with Built-In...

June 18, 2014



Researchers Submit Patent Application, "Wiring Board with Built-In Electronic Component and Method for Manufacturing Wiring Board with Built-In Electronic Component", for Approval

By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventor SHIMIZU, Keisuke (Ogaki-shi, JP), filed on November 29, 2013, was made available online on June 5, 2014.

The patent's assignee is Ibiden Co., Ltd.

News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a wiring board with a built-in electronic component, the wiring board having an active electronic component such as a semiconductor element or the like or a passive electronic component such as a chip condenser or the like, and a method for manufacturing the wiring board with a built-in electronic component.

"An IC chip may be mounted on a package substrate or may be built into a printed wiring board. JP 2006-19441 A describes a wiring board with a built-in semiconductor element in which a cavity is provided in a resin substrate or a resin layer and the semiconductor element is built into the cavity. The entire contents of this publication are incorporated herein by reference."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventor's summary information for this patent application: "According to one aspect of the present invention, a wiring board for a built-in electronic component includes a substrate having a cavity portion, an electronic component accommodated in the cavity portion of the substrate, a filling resin material filling a space formed between the electronic component and an inner wall of the substrate forming the cavity portion, an insulation layer formed on the substrate and the electronic component accommodated in the cavity portion of the substrate, and a via conductor formed in the insulation layer such that the via conductor is connected to a connection terminal of the electronic component. The substrate has projection portions formed on the inner wall of the substrate such that the projection portions project toward the electronic component accommodated in the cavity portion of the substrate.

"According to another aspect of the present invention, a method for manufacturing a wiring board having a built-in electronic component includes preparing a substrate having a cavity portion and projection portions on an inner wall of the substrate forming the cavity portion, placing an electronic component in the cavity portion of the substrate such that the electronic component is accommodated in the cavity portion of the substrate, filling a filling resin material into a space formed between the electronic component and the inner wall of the substrate forming the cavity portion, forming an insulation layer on the substrate and the electronic component accommodated in the cavity portion of the substrate, and forming a via conductor in the insulation layer such that the via conductor is connected to a connection terminal of the electronic component. The projection portions are formed on the inner wall of the substrate such that the projection portions project toward the electronic component accommodated in the cavity portion of the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

"A more complete appreciation of the invention and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:

"FIG. 1 is a cross-sectional view of a wiring board with a built-in electronic component according to a first embodiment of the present invention;

"FIGS. 2A, 2B, 2C are each a cross-sectional view of an insulative base material according to the first embodiment;

"FIGS. 3A to 3F are process drawings illustrating a method for manufacturing the wiring board with a built-in electronic component according to the first embodiment;

"FIGS. 4A to 4E are process drawings illustrating the method for manufacturing the wiring board with a built-in electronic component according to the first embodiment;

"FIGS. 5A to 5D are process drawings illustrating the method for manufacturing the wiring board with a built-in electronic component according to the first embodiment;

"FIG. 6A is a process drawing illustrating the method for manufacturing the wiring board with a built-in electronic component according to the first embodiment;

"FIGS. 7A, 7B are process drawings illustrating the method for manufacturing the wiring board with a built-in electronic component according to the first embodiment;

"FIG. 8 is a plan view illustrating a magnified through hole;

"FIGS. 9A to 9D are process drawings illustrating a method for manufacturing the wiring board with a built-in electronic component according to a first modified example of the first embodiment;

"FIG. 10 is a cross-sectional view of a wiring board with a built-in electronic component according to a second modified example of the first embodiment;

"FIGS. 11A, 11B are plan views each illustrating projections provided in the through hole;

"FIGS. 12A to 12D are plan views each illustrating projections provided in the through hole;

"FIG. 13 is a plan view illustrating projections provided in the through hole; and

"FIG. 14 is a graph illustrating a relationship between the height of projections and the amount of warping of the wiring board with a built-in electronic component."

For additional information on this patent application, see: SHIMIZU, Keisuke. Wiring Board with Built-In Electronic Component and Method for Manufacturing Wiring Board with Built-In Electronic Component. Filed November 29, 2013 and posted June 5, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=5467&p=110&f=G&l=50&d=PG01&S1=20140529.PD.&OS=PD/20140529&RS=PD/20140529

Keywords for this news article include: Electronics, Semiconductor, Ibiden Co. Ltd..

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Source: Electronics Newsweekly


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