News Column

Researchers Submit Patent Application, "Multi-Piece Substrate", for Approval

June 18, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors SHIMIZU, Keisuke (Ogaki-shi, JP); NAKAMURA, Yuichi (Ogaki-shi, JP); YAMAGUCHI, Tsuyoshi (Ogaki-shi, JP), filed on November 29, 2013, was made available online on June 5, 2014.

The patent's assignee is Ibiden Co., Ltd.

News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a multi-piece substrate used for simultaneously fabricating multiple wiring boards each having a built-in semiconductor element, more particularly to a multi-piece substrate in which unit components each including wiring boards arranged in a matrix are supported by a frame component (outer frame).

"An IC chip may not be mounted on a package substrate but may be built in a printed wiring board. JP 2009-289848 A describes a multi-piece substrate in which notches are provided in a frame component. The entire contents of this publication are incorporated herein by reference."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "According to one aspect of the present invention, A multi-piece substrate includes a unit component having four sides and including multiple wiring boards arrayed in a matrix, and a frame component supporting the unit component such that the frame component is surrounding an outer periphery of the unit component. Each of the wiring boards has a semiconductor element built therein, and the frame component has multiple slit portions formed such that the slit portions are formed along the four sides of the unit component, respectively.

BRIEF DESCRIPTION OF THE DRAWINGS

"A more complete appreciation of the invention and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:

"FIG. 1 is a plan view of a multi-piece substrate according to a first embodiment of the present invention;

"FIG. 2 is a cross-sectional view of a wiring board according to the first embodiment;

"FIGS. 3A to 3F are process drawings illustrating a method for manufacturing the multi-piece substrate according to the first embodiment;

"FIGS. 4A to 4E are process drawings illustrating the method for manufacturing the multi-piece substrate according to the first embodiment;

"FIGS. 5A to 5D are process drawings illustrating the method for manufacturing the multi-piece substrate according to the first embodiment;

"FIGS. 6A to 6D are process drawings illustrating the method for manufacturing the multi-piece substrate according to the first embodiment;

"FIG. 7 is a plan view of a multi-piece substrate according to a second embodiment of the invention;

"FIG. 8 is a plan view of a multi-piece substrate according to a third embodiment of the invention;

"FIG. 9 is a plan view of a multi-piece substrate according to a fourth embodiment of the invention; and

"FIG. 10 is a plan view of a multi-piece substrate according to a fifth embodiment of the invention."

For additional information on this patent application, see: SHIMIZU, Keisuke; NAKAMURA, Yuichi; YAMAGUCHI, Tsuyoshi. Multi-Piece Substrate. Filed November 29, 2013 and posted June 5, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=3653&p=74&f=G&l=50&d=PG01&S1=20140529.PD.&OS=PD/20140529&RS=PD/20140529

Keywords for this news article include: Electronics, Semiconductor, Ibiden Co. Ltd..

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Source: Electronics Newsweekly


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