No assignee for this patent application has been made.
News editors obtained the following quote from the background information supplied by the inventors: "This invention generally relates to data centers and more particularly to data storage appliances in data centers.
"Based on advances in communications technologies improving high-speed and high-bandwidth communication between remote locations, data centers have become a practical solution for implementing large-scale distributed computing systems. A data center typically houses racks of computer servers providing both processing and data storage functionalities, as well as telecommunication and networking equipment, such as switches and routers, for transmitting data from and receiving data for the servers.
"Conventional data centers rely on arrays of hard disk drives for data storage. However, solid state drives (SSDs) are becoming increasingly popular for options for data storage because of their lower access times and lower latency than conventional magnetic hard disk drives. Additionally, SSDs do not have moving parts, making them less susceptible to physical disruption and making them significantly quieter during operation. SSDs often share the same form factors and interfaces used by magnetic hard disk drives used in personal computers. However, conventional SSD interfaces and form factors are not suitable for use in high density storage appliances used in data centers."
As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventor's summary information for this patent application: "Embodiments of the present invention provide a high-density storage appliance comprising a printed circuit board (PCB) to which a plurality of solid state drives (SSDs) are coupled. Each of the SSDs has a connector positioned along a width of the SSD, which is shorter than a height of the SSD. Further, each SSD is coupled to the PCB such that an aspect ratio of a height of the SSD above the PCB to a width of the SSD in parallel to the PCB is greater than 1.0. The height of the SSDs may be increased without altering the width of the SSDs to increase the amount of storage available in the high-density storage appliance without increasing the area of the PCB. The SSDs may be arranged in a plurality of rows and a plurality of columns to simplify installation and removal of the SSDs and to facilitate airflow about the SSDs for cooling. Other types of memory modules may be used in other implementations.
BRIEF DESCRIPTION OF THE DRAWINGS
"FIG. 1 is a diagram of a gumstick layout of a memory module, in accordance with one embodiment.
"FIG. 2A is a top view of a high-density storage appliance, in accordance with one embodiment.
"FIG. 2B is a perspective view of a layout of a storage bank 202 of a high-density storage appliance, in accordance with an embodiment.
"The figures depict various embodiments of the present invention for purposes of illustration only. One skilled in the art will readily recognize from the following discussion that alternative embodiments of the structures and methods illustrated herein may be employed without departing from the principles of the invention described herein."
For additional information on this patent application, see: Coglitore, Giovanni. High Density Storage Applicance. Filed
Keywords for this news article include: Patents, Information Technology, Information and
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