News Column

Micron Technology Assigned Patent for Redistribution Elements and Semiconductor Device Packages

June 12, 2014



By Targeted News Service

ALEXANDRIA, Va., June 12 -- Micron Technology, Boise, Idaho, has been assigned a patent (8,749,050) developed by three co-inventors for "[r]edistribution elements and semiconductor device packages including semiconductor devices and redistribution elements." The co-inventors are David J. Corisis, Nampa, Idaho, Choon Kuan Lee, Singapore, and Chong Chin Hui, Singapore.

The patent application was filed on July 2, 2013 (13/933,294). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8749050.PN.&OS=PN/8749050&RS=PN/8749050

Written by Niel Bautista; edited by Marlyn Vitin.

22BautistaN 140612-1023787


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Source: Targeted News Service


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