News Column

Patent Issued for Wafer Cleaning Device

May 14, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- According to news reporting originating from Alexandria, Virginia, by VerticalNews journalists, a patent by the inventors Tsai, Hsin-Ting (Hsinchu, TW); Yu, Cheng-Hung (Taoyuan County, TW); Liu, Chin-Kuang (Hisnchu, TW); Lee, Ming-Hsin (Taoyuan County, TW); Chuang, Wei-Hong (Taoyuan County, TW); Tung, Kuei-Chang (Miaoli County, TW); Lu, Yan-Yi (Taoyuan County, TW); Wang, Chin-Chin (Yun-Lin County, TW), filed on December 11, 2009, was published online on April 29, 2014.

The assignee for this patent, patent number 8707974, is United Microelectronics Corp. (Science-Based Industrial Park, Hsin-Chu, TW).

Reporters obtained the following quote from the background information supplied by the inventors: "The present invention relates to a wafer cleaning device and method of cleaning a wafer.

"The formation of semiconductor device includes a lot of steps, such as implantation of dopants, formation of a gate oxide layer, deposition of a metal layer, etching process, and chemical mechanical polishing. It is well-known that there is a need to clean a wafer where a fabrication operation has been performed that leaves unwanted residues on the surfaces, edges, bevels, and notches of wafers.

"One wafer cleaning method commonly employed is wet cleaning. Generally, during a cleaning process, a cleaning solution such as deionized water, or other cleaning solutions is utilized to clean residues on a wafer, and the deionized water or cleaning solutions along with the residues is spun out of the surface of the wafer.

"A traditional wafer cleaning device includes a liquid supply system including a plurality of pipes, and a plurality of straight nozzles, each connecting to one end of the pipe. However, during the cleaning process, the cleaning solution may form turbulence on the periphery of the wafer. Then the residues washed away from the center of the wafer will stay on the surface of the wafer, so stains or striation defects may form.

"In view of the foregoing, there is a need for a cleaning apparatus and process that avoid the problems of the prior art by cleaning residues on the wafer completely."

In addition to obtaining background information on this patent, VerticalNews editors also obtained the inventors' summary information for this patent: "According to a preferred embodiment of the present invention, a wafer cleaning device is proposed, comprising: a stage for holding a wafer having a surface, a first nozzle positioned above the wafer, and a first height disposed between the first nozzle and the surface and a second nozzle positioned above the wafer, and a second height disposed between the second nozzle and the surface, wherein the first height is shorter than the second height.

"According to another preferred embodiment of the present invention, a wafer cleaning device is proposed, comprising: a stage for holding a wafer having a surface and a nozzle positioned above the wafer, and the nozzle comprising a plurality of openings, wherein a height is disposed between the surface and each of the openings, the height is changeable along with the relative location of each of the openings to the surface.

"According to another preferred embodiment of the present invention, a wafer cleaning method is proposed, comprising: providing a wafer having a surface and at least one nozzle above the wafer and rotating the wafer and spraying a cleaning solution by the nozzle to clean the surface, wherein the nozzle has a spraying parameter, and the spraying parameter is a function of the relative location of the nozzle to the surface.

"According to another preferred embodiment of the present invention, a wafer cleaning method is proposed, comprising: providing a wafer having a surface and a nozzle comprising a plurality of openings above the wafer and rotating the wafer and spraying a cleaning solution from each of the openings to clean the surface, wherein each of the openings has a spraying parameter individually, and the spraying parameter is a function of the relative location of each of the opening to the surface.

"The feature of the present invention is that the nozzle has a spraying parameter which is a function of the relative location of the nozzle to the surface or a function of the relative location of each of the openings to the surface. For instance, when the nozzles are different in horizontal position, the distance between the nozzle and the surface, the flow rate of the cleaning solution, the cleaning solution used, the ratio between the cleaning solution and the gas, or the concentration of the cleaning solution would be different. Therefore, the center and the periphery of the wafer may have different cleaning conditions. In this way, the residues on the surface can be removed completely.

"These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings."

For more information, see this patent: Tsai, Hsin-Ting; Yu, Cheng-Hung; Liu, Chin-Kuang; Lee, Ming-Hsin; Chuang, Wei-Hong; Tung, Kuei-Chang; Lu, Yan-Yi; Wang, Chin-Chin. Wafer Cleaning Device. U.S. Patent Number 8707974, filed December 11, 2009, and published online on April 29, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=125&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=6230&f=G&l=50&co1=AND&d=PTXT&s1=20140429.PD.&OS=ISD/20140429&RS=ISD/20140429

Keywords for this news article include: United Microelectronics Corp.

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


For more stories covering the world of technology, please see HispanicBusiness' Tech Channel



Source: Electronics Newsweekly


Story Tools






HispanicBusiness.com Facebook Linkedin Twitter RSS Feed Email Alerts & Newsletters