News Column

Patent Issued for Pressure Sensor Device, Electronic Apparatus, and Method of Mounting Pressure Sensor Device

May 14, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- Mitsumi Electric Co., Ltd. (Tokyo, JP) has been issued patent number 8707794, according to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

The patent's inventor is Usui, Takashi (Tokyo, JP).

This patent was filed on August 16, 2011 and was published online on April 29, 2014.

From the background information supplied by the inventors, news correspondents obtained the following quote: "A certain aspect of this disclosure relates to a pressure sensor device, an electronic apparatus including the pressure sensor device, and a method of mounting the pressure sensor device.

"FIG. 1 is a cut-away side view of a pressure sensor device 1 mounted on a circuit board 21. The pressure sensor device 1 includes a mounting substrate 12, a semiconductor pressure sensor element 11 mounted on the mounting substrate 12, and a housing 16 for housing (or packaging) the semiconductor pressure sensor element 11. Terminals 19 are provided on the mounting substrate 12. The pressure sensor device 1 is fixed to a mounting surface 21A of the circuit board 21 by soldering the terminals 19 with solder 32 onto the mounting surface 21A. The semiconductor pressure sensor element 11 is a chip for detecting a pressure supplied from a pressure supply port 17 formed in the housing 16.

"A pressure introducing port 18 communicating with the atmosphere may be formed in the mounting substrate 12 if the semiconductor pressure sensor element 11 needs to communicate with the atmosphere to implement its function. The pressure introducing port 18 is coaxially connected to a pressure introducing port 22 formed in the circuit board 21 and communicating with the atmosphere.

"A pressure sensor device including a semiconductor pressure sensor element is disclosed, for example, in Japanese Laid-Open Patent Publication No. 11-326088 and Japanese Laid-Open Patent Publication No. 2010-008434.

"With the configuration of FIG. 1, if the amount of flux in the solder for soldering the pressure sensor device 1 onto the circuit board 21 is large, liquefied flux tends to flow into a gap 33 formed between a mounting surface 12B of the mounting substrate 12 and the mounting surface 21A of the circuit board 21 due to the capillary action. The liquefied flux flown into the gap 33 proceeds along the mounting surface 12B and/or the mounting surface 21A due to their wettability and thus may clog the pressure introducing port 18 and/or the pressure introducing port 22. This in turn causes the pressure sensor device 1 to malfunction."

Supplementing the background information on this patent, VerticalNews reporters also obtained the inventor's summary information for this patent: "In an aspect of this disclosure, there is provided a pressure sensor device including a semiconductor pressure sensor element and a base part. The base part includes a mounting surface, a through hole having an opening on the mounting surface and configured to introduce a fluid to the semiconductor pressure sensor element, a soldered part that is to be soldered and is provided on the mounting surface, and a step-like structure formed on the mounting surface between the opening and the soldered part."

For the URL and additional information on this patent, see: Usui, Takashi. Pressure Sensor Device, Electronic Apparatus, and Method of Mounting Pressure Sensor Device. U.S. Patent Number 8707794, filed August 16, 2011, and published online on April 29, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=129&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=6409&f=G&l=50&co1=AND&d=PTXT&s1=20140429.PD.&OS=ISD/20140429&RS=ISD/20140429

Keywords for this news article include: Electronics, Circuit Board, Semiconductor, Mitsumi Electric Co. Ltd..

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Source: Electronics Newsweekly