News Column

Patent Issued for Multi-Chip Package with a Supporting Member and Method of Manufacturing the Same

May 14, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- According to news reporting originating from Alexandria, Virginia, by VerticalNews journalists, a patent by the inventors Lee, Hee-Jin (Hwaseong-si, KR); Lee, Woo-Dong (Hwaseong-si, KR), filed on August 4, 2012, was published online on April 29, 2014.

The assignee for this patent, patent number 8710677, is Samsung Electronics Co., Ltd. (KR).

Reporters obtained the following quote from the background information supplied by the inventors: "Example embodiments relate to a multi-chip package and a method of manufacturing the same. More particularly, example embodiments relate to a multi-chip package including a plurality of semiconductor chip sequentially stacked, and a method of manufacturing the multi-chip package.

"Generally, a plurality of semiconductor fabrication processes may be performed on a semiconductor substrate to form a plurality of semiconductor chips. In order to mount the semiconductor chips on a printed circuit board (PCB), a packaging process may be performed on the semiconductor chips to form semiconductor packages.

"In order to increase a storage capacity of the semiconductor package, a multi-chip package including a plurality of the semiconductor chip sequentially stacked have been developed. The semiconductor chips of the multi-chip package may have substantially the same size or different sizes. Further, the semiconductor chips having the same size may be crosswise stacked. When the semiconductor chips may have the different sizes, an upper semiconductor chip may have a size larger than that of a lower semiconductor chip.

"Therefore, the upper semiconductor chip may have a protrusion overhanging an area beyond both side surfaces of the lower semiconductor chip. Because the protrusion of the upper semiconductor chip may not be supported by the lower semiconductor chip, the protrusion may be deflected. Particularly, bonding pads of the upper semiconductor chips may be arranged on an upper surface of the protrusion. Thus, wire bonding failures may be generated due to the deflected protrusion. That is, a bonding wire may not be accurately connected to the bonding pads on the deflected protrusion.

"Further, a sufficient amount of a molding member may not be provided between the deflected protrusion and a package substrate. Thus, voids may be generated in the molding member between the deflected protrusion and the package substrate."

In addition to obtaining background information on this patent, VerticalNews editors also obtained the inventors' summary information for this patent: "Example embodiments provide a multi-chip package having a structure that may be capable of substantially preventing a protrusion of a semiconductor chip from being deflected.

"Example embodiments also provide a method of manufacturing the above-mentioned multi-chip package.

"According to some example embodiments, there is provided a multi-chip package. The multi-chip package may include a package substrate, a first semiconductor chip, a second semiconductor chip and a supporting member. The first semiconductor chip may be arranged on an upper surface of the package substrate. The first semiconductor chip may be electrically connected with the package substrate. The second semiconductor chip may be arranged on an upper surface of the first semiconductor chip. The second semiconductor chip may be electrically connected with the first semiconductor chip. The second semiconductor chip may have a protrusion overhanging an area beyond a side surface of the first semiconductor chip. The supporting member may be interposed between the protrusion of the second semiconductor chip and the package substrate to prevent a deflection of the protrusion.

"In example embodiments, the supporting member may have a width substantially the same as that of the protrusion.

"In example embodiments, the supporting member may have a width narrower than that of the protrusion. The width of the supporting member may be no less than about 50% of the width of the protrusion.

"In example embodiments, the first semiconductor chip and the second semiconductor chip may be crosswise stacked.

"In example embodiments, the first semiconductor chip may have a first long side and a first short side. The second semiconductor chip may have a second long side having a length greater than that of the first long side, and a second short side having a length substantially the same as that of the first short side.

"In example embodiments, the multi-chip package may further include a first conductive wire electrically connected between a first bonding pad of the first semiconductor chip and the package substrate, and a second conductive wire electrically connected between a second bonding pad of the second semiconductor chip and the package substrate.

"In example embodiments, the multi-chip package may further include an auxiliary bonding pad extending from the first bonding pad along an upper surface of the supporting member. The first conductive wire may be connected to the auxiliary bonding pad.

"In example embodiments, the multi-chip package may further include a molding member formed on the upper surface of the package substrate to cover the first semiconductor chip and the second semiconductor chip.

"According to some example embodiments, there is provided a method of manufacturing a multi-chip package. In the method of manufacturing the multi-chip package, a supporting member may be formed on a side surface of a first semiconductor chip. The first semiconductor chip may be stacked on an upper surface of a package substrate. A second semiconductor chip having a protrusion may be stacked on an upper surface of the first semiconductor chip to support the protrusion by the supporting member.

"In example embodiments, forming the supporting member may include attaching the first semiconductor chip to an upper surface of a supporting plate, and forming the supporting member on the upper surface of the supporting plate to expose the upper surface of the first semiconductor chip. Forming the supporting member may further include removing the supporting plate until the upper surface of the first semiconductor chip may be exposed.

"In example embodiments, the method may further include extending an auxiliary bonding pad from a first bonding pad of the first semiconductor chip along an upper surface of the supporting member.

"In example embodiments, the method may further include forming a molding member on the upper surface of the package substrate to cover the first semiconductor chip and the second semiconductor chip.

"According to example embodiments, the supporting member between the protrusion of the second semiconductor chip and the package substrate may support the protrusion to prevent a deflection of the protrusion. Thus, a position of the second bonding pad on the upper surface of the protrusion may not be changed, so that the second conductive wire may be accurately connected to the second bonding pad. Further, because a space between the protrusion and the package substrate may be filled with the supporting member, voids may not be generated in the space."

For more information, see this patent: Lee, Hee-Jin; Lee, Woo-Dong. Multi-Chip Package with a Supporting Member and Method of Manufacturing the Same. U.S. Patent Number 8710677, filed August 4, 2012, and published online on April 29, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=71&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=3542&f=G&l=50&co1=AND&d=PTXT&s1=20140429.PD.&OS=ISD/20140429&RS=ISD/20140429

Keywords for this news article include: Semiconductor, Samsung Electronics Co. Ltd..

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Source: Electronics Newsweekly


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