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Researchers Submit Patent Application, "Substrate with Built-In Electronic Component", for Approval

June 5, 2014



By a News Reporter-Staff News Editor at Politics & Government Week -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors SAWATARI, Tatsuro (Tokyo, JP); SUGIYAMA, Yuichi (Tokyo, JP); NAKAMURA, Hiroshi (Tokyo, JP); NAGANUMA, Masaki (Tokyo, JP); SAJI, Tetsuo (Tokyo, JP), filed on June 4, 2013, was made available online on May 22, 2014.

No assignee for this patent application has been made.

News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a substrate with built-in electronic component in which an electronic component is embedded in a substrate, and more particularly, to a substrate with built-in electronic component in which an electronic component is stored in a storage portion formed in a core layer.

"Known examples of substrates with built-in electronic component include a 'substrate not provided with a core layer' disclosed in Patent Document 1 below, for example, and a 'substrate provided with a core layer' disclosed in Patent Document 2 below, for example. The 'substrate not provided with a core layer' has a structure in which an electronic component is embedded in an insulating layer, and the electronic component is held in a proper place by being covered with a synthetic resin constituting the insulating layer. The 'substrate provided with a core layer' has a structure in which an electronic component is stored in a storage portion that is formed so as to penetrate the core layer. When there is space between the electronic component and inner walls of the storage portion, the space is filled with a synthetic region, and the electronic component is held in a proper position by being covered by the synthetic resin filler.

"In the 'substrate provided with a core layer,' if the synthetic resin filler has higher moisture absorbency than that of the core layer, the following problems occur. That is, because various electronic components are generally mounted on a substrate with built-in electronic component by the reflow soldering method, due to the heat generated in the reflow soldering, moisture included in the synthetic resin filler is evaporated, and tries to escape to the outside. When insulating layers made of a synthetic resin and conductive layers made of a metal are alternately formed on one surface and the other surface of the core layer in the thickness direction, the vapor tries to escape to the outside from the end of each insulating layer closest to the core layer, travelling through the insulating layer. However, because the path through which the vapor travels to be released to the outside is long, possible problems can be caused by the vapor, such as a crack in the respective insulating layers closest to the core layer, layer separation between the insulating layer and the core layer, and layer separation between the insulating layer and a conductive layer closest to the core layer."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "An object of the present invention is to provide a substrate with built-in electronic component that can prevent a problem of a crack in an insulating layer and the like.

"Additional or separate features and advantages of the invention will be set forth in the descriptions that follow and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims thereof as well as the appended drawings.

"To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described, in one aspect, the present invention provides a substrate with built-in electronic component including: a core layer having a storage portion penetrating the core layer; an electronic component stored in the storage portion; a synthetic resin filler filling a space between the electronic component and inner walls of the storage portion, the synthetic resin filler having a higher moisture absorbency than that of the core layer; and two or more pairs of an insulating layer and a conductive layer disposed on two opposite surfaces of the core layer in a thickness direction, respectively, the insulating layers being made of a synthetic resin, the conductive layers being made of a metal, wherein, of the two or more pairs of the insulating layer and the conductive layers disposed on at least one of two opposite surfaces of the core layer in a thickness direction, a conductive layer closest to the core layer has at least one first penetrating hole formed therein so as to overlap at least part of an opening edge of the storage portion in a plan view.

"According to the present invention, it is possible to provide a substrate with built-in electronic component that can prevent a problem of a crack in an insulating layer and the like.

"The above-mentioned objects, other objects, and features and effects for the respective objects of the present invention will be made apparent from the descriptions that follow and appended drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

"FIG. 1 is a vertical cross-sectional view showing a main part of a substrate with built-in electronic component according to Embodiment 1 of the present invention.

"FIG. 2 is a horizontal cross-sectional view along the line S2-S2 of FIG. 1.

"FIG. 3 is a horizontal cross-sectional view along the line S3-S3 of FIG. 1.

"FIG. 4 is a horizontal cross-sectional view along the line S4-S4 of FIG. 1.

"FIG. 5 is a horizontal cross-sectional view along the line S5-S5 of FIG. 1.

"FIG. 6 is a horizontal cross-sectional view along the line S6-S6 of FIG. 1.

"FIG. 7 is a horizontal cross-sectional view along the line S7-S7 of FIG. 1.

"FIG. 8 is a vertical cross-sectional view showing a main part of a substrate with built-in electronic component according to Embodiment 2 of the present invention.

"FIG. 9 is a horizontal cross-sectional view of FIG. 8 corresponding to FIG. 3.

"FIG. 10 is a horizontal cross-sectional view of FIG. 8 corresponding to FIG. 4."

For additional information on this patent application, see: SAWATARI, Tatsuro; SUGIYAMA, Yuichi; NAKAMURA, Hiroshi; NAGANUMA, Masaki; SAJI, Tetsuo. Substrate with Built-In Electronic Component. Filed June 4, 2013 and posted May 22, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=4184&p=84&f=G&l=50&d=PG01&S1=20140515.PD.&OS=PD/20140515&RS=PD/20140515

Keywords for this news article include: Patents.

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Source: Politics & Government Week


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