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Researchers Submit Patent Application, "Image Sensor Assembly for Removing Dust from a Surface of an Image Sensor", for Approval

June 4, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors Ji, Eun-ho (Seoul, KR); Hwang, Chi-hun (Yongin-si, KR), filed on January 22, 2014, was made available online on May 22, 2014.

The patent's assignee is Samsung Electronics Co., Ltd.

News editors obtained the following quote from the background information supplied by the inventors: "The invention relates to an image sensor assembly, and more particularly, to an image sensor assembly capable of effectively removing dust or the like sticking onto a surface of an image sensor.

"An image sensor, such as a charge-coupled device (CCD) sensor, a complementary metal-oxide-semiconductor (CMOS) sensor, or the like, is installed in a digital image photographing apparatus, such as a digital camera, a digital camcorder, or the like. The image sensor is for capturing an image. Such an image sensor corresponds to a film of a conventional analog camera, and dust or the like sticking onto a surface of the image sensor may badly affect a quality of a captured image."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "Various embodiments of the invention provide an image sensor assembly capable of effectively removing dust sticking onto a surface of an image sensor; provide an image sensor assembly which can be manufactured to have a simple, small, and light structure and a dust removal function; provide an image sensor assembly which can be easily disassembled and assembled and have a dust removal function; and provide an image sensor assembly which can vibrate a vibrator to effectively remove dust and stably maintain combination states of components even when the vibrator repeatedly vibrates.

"According to an embodiment of the invention, there is provided an image sensor assembly including: an image sensor; a support plate which is disposed on a back surface of the image sensor; a first frame which includes a first hole which is open to allow light to be incident onto the image sensor and is disposed on a front surface of the support plate to enclose at least a side edge of the image sensor; an optical filter which is disposed in the first hole to block a part of the incident light; a second frame which includes a second hole which is open to allow light to be incident onto the optical filter and is disposed in front of the first frame; a front plate which is disposed in front of the second hole to contact a front surface of at least a side edge of the second frame; and a vibrator which is combined with at least a side edge of the front plate and vibrates according to an electric signal which is applied from the outside.

"The image sensor assembly may further include combination plates, each of which includes an end contacting at least a part of a front surface of the front plate and the other end combined with the support plate to pressurize the front plate, the second frame, and the first frame against the support plate.

"The image sensor assembly may further include combination plates which include pressurization plates which contact at least a part of a front edge of the front plate and connection plates which are connected to the pressurization plates and are bent toward the first frame to be combined with the support plate.

"The connection plates may include combination holes through which combiners pass, wherein the combiners are combined with the support plate through the combination holes so that the connection plates are combined with the support plate.

"The first frame may include extension parts which extend toward positions at which the combiners are combined with the support plate and have holes through which the combiners pass, wherein the combiners are combined with the support plate through the combination holes of the connection plates and the holes of the extension parts.

"The image sensor assembly may further include a shock absorbent plate which is disposed between the image sensor and the first frame so that a back surface thereof contacts a front surface of the image sensor and a front surface thereof contacts the first frame.

"The vibrator may be a piezoelectric device.

"The second frame may include protrusion parts which protrude from a front surface thereof toward the front plate.

"The protrusion parts may extend along edges of the second frame.

"The front plate may include four edges, wherein at least two combination plates are disposed to contact at least two of the four edges of the front plate.

"The front plate may include four edges, wherein at least three combination plates are disposed to contact at least three of the four edges of the front plate.

BRIEF DESCRIPTION OF THE DRAWINGS

"The above and other features and advantages of the invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which:

"FIG. 1 is a schematic side sectional view of a digital photographing apparatus including an image sensor assembly, according to an embodiment of the invention;

"FIG. 2 is an exploded perspective view illustrating combination relations among components of the image sensor assembly of the digital photographing apparatus of FIG. 1;

"FIG. 3 is a side view illustrating the components of the image sensor assembly of FIG. 1;

"FIG. 4 is a cross-sectional view of the image sensor assembly of FIG. 1, which is completely assembled; and

"FIG. 5 is a front view of the image sensor assembly of FIG. 4."

For additional information on this patent application, see: Ji, Eun-ho; Hwang, Chi-hun. Image Sensor Assembly for Removing Dust from a Surface of an Image Sensor. Filed January 22, 2014 and posted May 22, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=4483&p=90&f=G&l=50&d=PG01&S1=20140515.PD.&OS=PD/20140515&RS=PD/20140515

Keywords for this news article include: Samsung Electronics Co. Ltd.

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Source: Electronics Newsweekly


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