News Column

Patent Issued for Power Module Package

June 4, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- According to news reporting originating from Alexandria, Virginia, by VerticalNews journalists, a patent by the inventors Kim, Kwang Soo (Gyunggi-do, KR); Kwak, Young Hoon (Gyunggi-do, KR); Lee, Young Ki (Gyunggi-do, KR), filed on January 18, 2012, was published online on May 20, 2014.

The assignee for this patent, patent number 8729692, is Samsung Electro-Mechanics Co., Ltd. (Gyunggi-Do, KR).

Reporters obtained the following quote from the background information supplied by the inventors: "The present invention relates to a power module package.

"Due to the increase of energy consumption throughout the world, people have started to show great interest in how to efficiently use limited energy. In line with extensive applications of power modules, multifunctional and compact power modules are currently in demand, but a problem of heat generation of electronic components in response to the multifunction and reduction in size results in a degradation of the overall performance of modules.

"Thus, in order to increase the efficiency and obtain high reliability of power modules, a highly dissipating water cooling power module package structure capable of solving the foregoing heat generation problem is required.

"In general, as disclosed in Document 1, a heat dissipation system is formed by separately fabricating a power module package and a heat dissipation system and then coupling them, and here, fabrication unit cost of the power module package and that of the heat dissipation system are high and it is not easy to change design of a water cooling channel for enhancing heat dissipation efficiency of the heat dissipation system, thereby making it difficult to apply various modules thereto and effectively dissipate heat.

"Also, the heat dissipation system having the foregoing structure dissipates only one face in terms of the structure of the power module, which can hardly be applied to a power module package employing a high heating insulated gate bipolar transistor (IGBT) applied to various fields including electric vehicles, industries, renewable purpose, and the like, and such low heat dissipation makes it difficult to highly integrate high heating semiconductor devices. [Document 1] KR 10-2004-0064995 A Jul. 21, 2004"

In addition to obtaining background information on this patent, VerticalNews editors also obtained the inventors' summary information for this patent: "The present invention has been made in an effort to provide a power module package that can be highly integrated, reduced in size and can be lightweight by employing a heat dissipation plate which can serve as a substrate including a cooling flow path having a form when upper and lower portions are integrated.

"According to a first preferred embodiment of the present invention, there is provided a power module package including: a first heat dissipation plate including a first flow path, a second flow path, and a third flow path which are sequentially formed, the first flow path and the third flow path being formed to have a step therebetween; a second heat dissipation plate formed under the first heat dissipation plate, having one face and the other face, having a semiconductor device mounting groove formed in the one face thereof, and including a fourth flow path having one end connected to the second flow path and the other end connected to the third flow path; insulating layers formed on the first heat dissipation plate and the second heat dissipation plate; metal layers including a circuit pattern and a connection pad formed on the insulating layers; and a semiconductor device formed on the metal layers, wherein a cooling material introduced through the first flow path is distributed to the third flow path and the fourth flow path based on the second flow path.

"The first heat dissipation plate and the second heat dissipation plate may be made of a metallic material.

"The semiconductor device may include a power element and a control element.

"When the semiconductor device is a power element, the semiconductor device may be formed between the metal layer of the first heat dissipation plate and that of the second heat dissipation plate.

"The cooling material may be water or a refrigerant.

"The insulating layers may be made of a ceramic material.

"The first flow path may be a region to which the cooling material is introduced, and the third flow path may be a region from which the cooling material is discharged.

"The insulating layers may be formed on opposite faces of the first heat dissipation plate and the second heat dissipation plate.

"The semiconductor device may be formed to be positioned in the semiconductor device mounting groove.

"The power module package may further include: an adhesive layer formed between the semiconductor device and the metal layer.

"The first flow path, the second flow path, and the third flow path may be formed to be sequentially connected at the center of the first heat dissipation plate based on a thicknesswise direction thereof.

"The second flow path and the third flow path may have holes formed at portions thereof each in contact with the fourth flow path, toward the second heat dissipation plate.

"The fourth flow path may be formed at the center of the second heat dissipation plate based on a thicknesswise direction thereof.

"The second heat dissipation plate may further include a first connection portion formed to be connected to one end of the fourth flow path of one face thereof and including a first connection groove corresponding to the first flow path, the second flow path, the third flow path, and the fourth flow path.

"The second heat dissipation plate may further include a second connection portion formed to be connected to the other end of the fourth flow path of one face thereof and including a second connection groove corresponding to the third flow path and the fourth flow path.

"According to a second preferred embodiment of the present invention, there is provided a power module package including: a first heat dissipation plate including a first flow path, a second flow path, and a third flow path which are sequentially formed, the first flow path and the third flow path being formed to have a step therebetween; and a second heat dissipation plate formed under the first heat dissipation plate, having one face and the other face, having a semiconductor device mounting groove formed in the one face thereof, and including a fourth flow path having one end connected to the second flow path and the other end connected to the third flow path, wherein a cooling material introduced through the first flow path is distributed to the third flow path and the fourth flow path based on the second flow path, and the second heat dissipation plate includes a first connection portion formed to be connected to one end of the fourth flow path of one face thereof and including a first connection groove corresponding to the first flow path, the second flow path, the third flow path, and the fourth flow path, and a second connection portion formed to be connected to the other end of the fourth flow path of one face thereof and including a second connection groove corresponding to the third flow path and the fourth flow path.

"The power module package may further include: insulating layers formed on the first heat dissipation plate and the second heat dissipation plate; metal layers including a circuit pattern and a connection pad formed on the insulating layers; and a semiconductor device formed on the metal layers."

For more information, see this patent: Kim, Kwang Soo; Kwak, Young Hoon; Lee, Young Ki. Power Module Package. U.S. Patent Number 8729692, filed January 18, 2012, and published online on May 20, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=76&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=3790&f=G&l=50&co1=AND&d=PTXT&s1=20140520.PD.&OS=ISD/20140520&RS=ISD/20140520

Keywords for this news article include: Electronics, Semiconductor, Samsung Electro-Mechanics Co. Ltd..

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Source: Electronics Newsweekly


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