News Column

Patent Issued for Organic Light Emitting Diode Display and Manufacturing Method

June 4, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- A patent by the inventors Lee, So-Young (Yongin, KR); Cho, Yoon-Hyeung (Yongin, KR); Oh, Min-Ho (Yongin, KR); Lee, Byoung-Duk (Yongin, KR); Kim, Yong-Tak (Yongin, KR); Cho, Sang-Hwan (Yongin, KR); Chung, Yun-Ah (Yongin, KR); Song, Seung-Yong (Yongin, KR); Lee, Jong-Hyuk (Yongin, KR), filed on November 22, 2011, was published online on May 20, 2014, according to news reporting originating from Alexandria, Virginia, by VerticalNews correspondents.

Patent number 8729797 is assigned to Samsung Display Co., Ltd. (Yongin-si, KR).

The following quote was obtained by the news editors from the background information supplied by the inventors: "Aspects of embodiments of the present invention relate generally to an organic light emitting diode (OLED) display and a manufacturing method thereof.

"An organic light emitting diode (OLED) display includes two electrodes and an organic emission layer disposed between the two electrodes. Electrons injected from one electrode and holes injected from the other electrode are coupled with each other in the organic emission layer to form excitons. The excitons emit light while passing from an excited state to a ground state.

"In order to protect such an OLED display, a laminating film may be formed on a surface of the OLED display. The laminating film may require a laminating film patterning process because the laminating film should not be formed on a pad formed in a peripheral area of the OLED display. The laminating film patterning process may be performed, for example, using a photolithography process, a laser cutting process, or a press process.

"However, the photolithography process may cause damage to the OLED display under the laminating film. In addition, in the laser cutting process or the press process, the laminating film should be processed using an additional cutting or press device before attaching the laminating film to the OLED display. This can lead to increased process time and cost. Further, when using such laminating film pattering processes, a pattern change due to a model change of the OLED display cannot be easily performed.

"The above information disclosed in this Background section is only for enhancement of understanding of the background of the described technology and therefore it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art."

In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventors' summary information for this patent: "Aspects of embodiments of the present invention relate to an organic light emitting diode (OLED) display that can be manufactured through a simple process while reducing cost, and a manufacturing method thereof.

"In an exemplary embodiment according to the present invention, an organic light emitting diode (OLED) display is disclosed. The OLED display includes an organic emission layer on a substrate including a pixel area and a peripheral area, a thin film encapsulation layer covering the organic emission layer corresponding to the pixel area of the substrate; and a pixel laminating film covering the thin film encapsulation layer corresponding to the pixel area of the substrate. The pixel laminating film includes one or more pixel adhesive layers that each comprise an acryl-based adhesive, a di-functional ultraviolet (UV) oligomer, and a hexa-functional UV oligomer.

"An upper pixel adhesive layer and a lower pixel adhesive layer from among the pixel adhesive layers may have different di-functional UV oligomer concentrations and different hexa-functional UV oligomer concentrations.

"A di-functional UV oligomer concentration of the upper pixel adhesive layer may be larger than a di-functional UV oligomer concentration of the lower pixel adhesive layer.

"A sum of the di-functional UV oligomer concentration and a hexa-functional UV oligomer concentration of the upper pixel adhesive layer may be less than a sum of the di-functional UV oligomer concentration and a hexa-functional UV oligomer concentration of the lower pixel adhesive layer.

"The thin film encapsulation layer may correspond to the pixel area of the substrate, and may include the di-functional UV oligomer and the hexa-functional UV oligomer.

"An upper pixel adhesive layer from among the pixel adhesive layers and the thin film encapsulation layer may have different di-functional UV oligomer concentrations and different hexa-functional UV oligomer concentrations.

"A di-functional UV oligomer concentration of the thin film encapsulation layer is less than a di-functional UV oligomer concentration of the upper pixel adhesive layer.

"A sum of the di-functional UV oligomer concentration and a hexa-functional UV oligomer concentration of the thin film encapsulation layer may be larger than a sum of the di-functional UV oligomer concentration and a hexa-functional UV oligomer concentration of the upper pixel adhesive layer.

"According to another exemplary embodiment of the present invention, a manufacturing method of an organic light emitting diode (OLED) display is disclosed. The method includes: forming an organic emission layer and a thin film encapsulation layer covering the organic emission layer on a substrate including a pixel area and a peripheral area; adhering a laminating film comprising a plurality of adhesive layers and an upper protective layer that covers an upper adhesive layer from among the plurality of adhesive layers on the thin film encapsulation layer, a lower adhesive layer from among the plurality of adhesive layers contacting the thin film encapsulation layer; radiating ultraviolet (UV) light on the laminating film that corresponds to the peripheral area of the substrate to decrease adhesion between the lower adhesive layer and the thin film encapsulation layer corresponding to the peripheral area of the substrate; and peeling the laminating film corresponding to the peripheral area of the substrate from the thin film encapsulation layer to maintain the laminating film that corresponds to the pixel area of the substrate.

"Each of the plurality of adhesive layers may contain an acryl-based adhesive, a di-functional UV oligomer, and a hexa-functional UV oligomer.

"A di-functional UV oligomer concentration of the upper adhesive layer may be larger than a di-functional UV oligomer concentration of the lower adhesive layer.

"A sum of the di-functional UV oligomer concentration and a hexa-functional UV oligomer concentration of the upper adhesive layer may be less than a sum of the di-functional UV oligomer concentration and a hexa-functional UV oligomer concentration of the lower adhesive layer.

"The peeling of the laminating film corresponding to the peripheral area of the substrate may include peeling the upper protective layer that corresponds to the pixel area of the substrate from the upper adhesive layer.

"The method may further include curing the laminating film that corresponds to the pixel area of the substrate after the peeling of the laminating film corresponding to the peripheral area of the substrate.

"According to yet another exemplary embodiment of the present invention, a manufacturing method of an organic light emitting diode (OLED) display is provided. The method includes: forming an organic emission layer and a thin film encapsulation layer that covers the organic emission layer and contains a di-functional ultraviolet (UV) oligomer and a hexa-functional UV oligomer on a substrate including a pixel area and a peripheral area; adhering a laminating film comprising one or more adhesive layers and an upper protective layer covering an upper adhesive layer from among the adhesive layers on the thin film encapsulation layer; radiating ultraviolet (UV) light on the laminating film and the thin film encapsulation layer that corresponds to the peripheral area of the substrate to decrease adhesion between the thin film encapsulation layer and the organic emission layer corresponding to the peripheral area of the substrate; and peeling the laminating film and the thin film encapsulation layer corresponding to the peripheral area of the substrate from the organic emission layer to maintain the laminating film and the thin film encapsulation layer corresponding to the pixel area of the substrate.

"Each of the adhesive layers may contain an acryl-based adhesive, a di-functional UV oligomer, and a hexa-functional UV oligomer.

"A di-functional UV oligomer concentration of the thin film encapsulation layer may be less than a di-functional UV oligomer concentration of the upper adhesive layer.

"A sum of the di-functional UV oligomer concentration and a hexa-functional UV oligomer concentration of the thin film encapsulation layer may be larger than a sum of the di-functional UV oligomer concentration and a hexa-functional UV oligomer concentration of the upper adhesive layer.

"The peeling of the laminating film and the thin film encapsulation layer corresponding to the peripheral area of the substrate may include peeling the upper protective layer that corresponds to the pixel area of the substrate from the upper adhesive layer.

"The method may further include curing the laminating film that corresponds to the pixel area of the substrate after the peeling of the laminating film and the thin film encapsulation layer corresponding to the peripheral area of the substrate.

"According to exemplary embodiments of the present invention as discussed above, a pattern change of the laminating film due to a model change of the OLED display can be easily performed through such a laminating film patterning process. Further, since no additional cutting device or press device is required, the process time can be shortened and the process cost can be reduced."

URL and more information on this patent, see: Lee, So-Young; Cho, Yoon-Hyeung; Oh, Min-Ho; Lee, Byoung-Duk; Kim, Yong-Tak; Cho, Sang-Hwan; Chung, Yun-Ah; Song, Seung-Yong; Lee, Jong-Hyuk. Organic Light Emitting Diode Display and Manufacturing Method. U.S. Patent Number 8729797, filed November 22, 2011, and published online on May 20, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=74&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=3685&f=G&l=50&co1=AND&d=PTXT&s1=20140520.PD.&OS=ISD/20140520&RS=ISD/20140520

Keywords for this news article include: Electronics, Photolithography, Light-emitting Diode, Samsung Display Co. Ltd.

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Source: Electronics Newsweekly


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