Semiconductor Manufacturing International Corp. announced that the company has ramped up wafer productions for fingerprint sensors with stable and robust solutions.
Fingerprint sensor is the key device of fingerprint identification and automatic collection.
According to a company release, SMIC's fingerprint sensors manufacturing solution has complete independent IP design modules and delivers excellent yield rate and cost optimization. In addition, SMIC's wafer solutions for fingerprint sensor adopt a special coating protection process which enhances the surface coating's hardness to make it more solid and scratch resistant.
"At present, SMIC's wafer manufacturing solutions for fingerprint recognition has been widely accepted and welcomed by various customers, and has received a positive market response," said Mike Rekuc, Executive Vice President of SMIC Worldwide Sales and Marketing. "One of our important customers, Fingerprint Cards AB (FPC), a leading provider of fingerprint sensors, has its product based on one of SMIC's stable and robust semiconductor process. This particular customer has occupied a dominant position, both in the mobile space where they are included in 23 launched Android mobile devices, and in the fixed space where they enjoy a market share in excess of 80 percent in the Chinese market through sales to all major Chinese banks. This is confirming FPC's leading position in the market for capacitive fingerprint sensor devices, as well as demonstrating SMIC's outstanding manufacturing and service capabilities to provide competitive products to customers and help them hit and enlarge their target market."
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