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Invensas to Demo Latest Innovations in Mobility, LED and 3D-ICs at ECTC 2014

May 27, 2014



SAN JOSE, Calif.--(BUSINESS WIRE)-- Tessera Technologies, Inc. (Nasdaq:TSRA), announced today that Invensas Corporation, its wholly owned subsidiary, will feature its recent advancements in 3D-IC, LED and mobility solutions at the upcoming IEEE Electronic Components and Technology Conference (ECTC) 2014 in Lake Buena Vista, Fla.May 27-30, 2014.

Invensas will showcase its technology in booth # 406 and present four papers as part of the conference:

  • “Wafer-Level LED Packaging with Optimal Light Output and Thermal Dissipation for High-Brightness,” on Wednesday, May 28, 2014, at 10:50 a.m. ET
  • “Process Compatibility of Conventional and Low-Temperature Polyimide Materials for 2.5D and 3D-IC Packaging: A User’s Perspective,” on Wednesday, May 28, 2014, at 2 p.m. ET
  • “TSV Module Optimization for High-Performance Silicon Interposers,” on Thursday, May 29, 2014, at 3:30 p.m. ET
  • “Manufacturing Readiness of BVA Technology for Ultra-High-Bandwidth Package-on-Package,” on Friday, May 30, 2014, at 4:45 p.m. ET

    More details on Invensas’ innovative interconnect technology can be found at www.invensas.com.

    About Tessera and Invensas

    Tessera Technologies, Inc. and Invensas Corporation, its wholly owned subsidiary, (Nasdaq: TSRA - News), are global leaders in semiconductor interconnect solutions and intellectual property. We innovate in areas such as mobile computing and communications, memory and data storage, MEMS, LED, and 3-D Integrated Circuit (3DIC) technologies. We are headquartered in San Jose, California, and license our solutions to Original Equipment Makers, Original Design Manufacturers, and Integrated Device Manufactures and deliver the products to market through collaborative engineering partnerships and strategic business alliances. Learn more at www.interconnectology.com or www.invensas.com, or contact our press relations at +1 408 324 5105.

    Invensas, the Invensas logo, Tessera, the Tessera logo and BVA are trademarks or registered trademarks of affiliated companies of Tessera Technologies, Inc. in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

    TSRA-G




    Tessera Technologies, Inc.

    Robert Andersen, 408-321-6779

    Executive Vice President and Chief Financial Officer

    or

    The Piacente Group | Investor Relations

    Don Markley or Glenn Garmont, 212-481-2050

    Tessera@tpg-ir.com


    Source: Tessera Technologies, Inc.


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    Source: Business Wire


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