“Wafer-Level LED Packaging with Optimal Light Output and Thermal
Dissipation for High-Brightness,” on Wednesday, May 28, 2014, at 10:50
“Process Compatibility of Conventional and Low-Temperature Polyimide
Materials for 2.5D and 3D-IC Packaging: A User’s Perspective,” on
Wednesday, May 28, 2014, at 2 p.m. ET
“TSV Module Optimization for High-Performance Silicon Interposers,” on
Thursday, May 29, 2014, at 3:30 p.m. ET
“Manufacturing Readiness of BVA Technology for Ultra-High-Bandwidth
Package-on-Package,” on Friday, May 30, 2014, at 4:45 p.m. ET
SAN JOSE, Calif.--(BUSINESS WIRE)--
Tessera Technologies, Inc. (Nasdaq:TSRA), announced today that Invensas
Corporation, its wholly owned subsidiary, will feature its recent
advancements in 3D-IC, LED and mobility solutions at the upcoming IEEE
Electronic Components and Technology Conference (ECTC) 2014 in Lake
Buena Vista, Fla.May 27-30, 2014.
Invensas will showcase its technology in booth # 406 and present four
papers as part of the conference:
More details on Invensas’ innovative interconnect technology can be
found at www.invensas.com.
About Tessera and Invensas
Tessera Technologies, Inc. and Invensas Corporation, its wholly owned
subsidiary, (Nasdaq: TSRA - News), are global leaders in semiconductor
interconnect solutions and intellectual property. We innovate in areas
such as mobile computing and communications, memory and data storage,
MEMS, LED, and 3-D Integrated Circuit (3DIC) technologies. We are
headquartered in San Jose, California, and license our solutions to
Original Equipment Makers, Original Design Manufacturers, and Integrated
Device Manufactures and deliver the products to market through
collaborative engineering partnerships and strategic business alliances.
Learn more at www.interconnectology.com
or contact our press relations at +1 408 324 5105.
Invensas, the Invensas logo, Tessera, the Tessera logo and BVA are
trademarks or registered trademarks of affiliated companies of Tessera
Technologies, Inc. in the United States and other countries. All other
company, brand and product names may be trademarks or registered
trademarks of their respective companies.
Tessera Technologies, Inc.
Robert Andersen, 408-321-6779
Vice President and Chief Financial Officer
Group | Investor Relations
Don Markley or Glenn Garmont,
Source: Tessera Technologies, Inc.