CHANDLER, Ariz. & IPOH, Malaysia--(BUSINESS WIRE)--
Amkor Technology, Inc. (Nasdaq:AMKR) and Carsem (M) Sdn Bhd today
jointly announced the settlement of the litigation initiated by Amkor
against Carsem alleging infringement of Amkor’s MicroLeadFrame®
The parties have entered into a settlement agreement to end all pending
proceedings related to the dispute and Carsem will pay Amkor an agreed
sum for such settlement.
Under the terms of the agreement, Carsem and Amkor have granted each
other non-exclusive licenses to their respective MLF and MLP patents
“We are pleased that Carsem has agreed to take a license to our industry
leading MLF patent family, and that we can finally close this
long-running dispute,” said Steve Kelley, Amkor’s president and chief
“With this settlement, we are happy that the dispute is behind us and
our customers will have the benefits of the license,” said Peter Yates,
managing director of Carsem.
Amkor is a leading provider of semiconductor packaging and test services
to semiconductor companies and electronics OEMs. More information about
Amkor is available from the company's filings with the Securities and
Exchange Commission and on Amkor's website: www.amkor.com.
Carsem is a leading provider of turnkey packaging and test services to
the semiconductor industry, and offers one of the widest ranges of
package & test portfolios in the world. To meet the growing demands of
the telecommunications and wireless markets for smaller, faster,
thermally-efficient devices, Carsem's portfolio includes many advanced
technologies, such as the Micro Leadframe Package (MLP), Flip Chip on
Leadframe (FCOL™), an SiP (System-in-Package) Technology, Cavity-Package
Motion and Pressure Sensor technologies as well as stacked-die
capability. Carsem also offers a full range of turnkey test services for
RF, mixed-signal, linear, digital and power devices. Our factories
maintain world-class quality standards having achieved SAC Level 1,
ISO-9001, ISO-14001, QS-9000, TS16949, ANSI-ESD S20.20 certifications,
and are supported with a global network of sales and engineering support
offices. Carsem is a member of the Hong Leong Group with factories
located in Ipoh, Malaysia, Suzhou, China and sales offices across the
USA, the UK, China, Malaysia and Taiwan. More information is available
on the Carsem website: www.carsem.com.
Amkor Technology, Inc.
Senior Director, Investor
Relations and Corporate Communications
Source: Amkor Technology, Inc.