News Column

Patent Issued for Packages and Methods for Packaging Using a Lid Having Multiple Conductive Layers

May 28, 2014



By a News Reporter-Staff News Editor at Journal of Engineering -- Analog Devices, Inc. (Norwood, MA) has been issued patent number 8723308, according to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

The patent's inventors are Yang, Jicheng (North Andover, MA); Chowdhury, Asif (Middleton, MA); Mena, Manolo (Manila, PH); Gao, Jia (Winchester, MA); Sullivan, Rick (Salem, MA); Goida, Thomas (Windham, NH); Tiongson, Carlo (Cavite, PH); Sengupta, Dipak (Boxborough, MA).

This patent was filed on November 17, 2011 and was published online on May 13, 2014.

From the background information supplied by the inventors, news correspondents obtained the following quote: "The present application relates to integrated device packages and methods for packaging the same.

"Integrated devices, such as integrated circuit (IC) devices or microelectromechanical systems (MEMS) devices, are often secured within a package for a variety of reasons, including, for example, protection from the environment, radio frequency (RF) shielding, and/or to aid in connecting the devices to a larger circuit. The packaged integrated devices can include a package lid mounted to a package substrate. Depending upon the environment of use, the package should also be durable and withstand impact.

"There is a need for improved packaging of integrated devices, including improved RF shielding."

Supplementing the background information on this patent, VerticalNews reporters also obtained the inventors' summary information for this patent: "In one embodiment, a packaged integrated device comprises a package substrate, a package lid, and an integrated device die. The package lid is attached to the package substrate using an adhesive, and the package lid and the package substrate can define a package interior. The package lid includes a first conductive layer, a second conductive layer and a core disposed between the first and second conductive layers. The first and second conductive layers comprise different materials. The first conductive layer defines a first surface of the package lid facing the package interior, and the second conductive layer defines a second surface of the package lid opposite the first surface. A portion of the first conductive layer contacts the adhesive. The integrated device die is mounted within the package interior.

"In another embodiment, a lid for an integrated circuit or MEMS package includes a core material shaped to define an interior core surface and an exterior core surface. A tin (Sn) coating is on the exterior core surface. A nickel (Ni) coating is on at least a portion of the interior core surface and forms an interface surface of the lid configured for attaching to a package substrate.

"In another embodiment, a method of packaging an integrated device comprises providing a lid. The lid comprises a lid core having an inner surface and an outer surface, a first conductive layer covering at least a portion of the inner surface of the lid core, and a second conductive layer covering at least a portion of the outer surface of the lid core. The first and second conductive layers comprise different materials

"For purposes of summarizing the invention and the advantages achieved over the prior art, certain objects and advantages of the invention have been described herein above. Of course, it is to be understood that not necessarily all such objects or advantages may be achieved in accordance with any particular embodiment of the invention. Thus, for example, those skilled in the art will recognize that the invention may be embodied or carried out in a manner that achieves or optimizes one advantage or group of advantages as taught or suggested herein without necessarily achieving other objects or advantages as may be taught or suggested herein.

"All of these embodiments are intended to be within the scope of the invention herein disclosed. These and other embodiments will become readily apparent to those skilled in the art from the following detailed description of the preferred embodiments having reference to the attached figures, the invention not being limited to any particular preferred embodiment(s) disclosed."

For the URL and additional information on this patent, see: Yang, Jicheng; Chowdhury, Asif; Mena, Manolo; Gao, Jia; Sullivan, Rick; Goida, Thomas; Tiongson, Carlo; Sengupta, Dipak. Packages and Methods for Packaging Using a Lid Having Multiple Conductive Layers. U.S. Patent Number 8723308, filed November 17, 2011, and published online on May 13, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=73&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=3630&f=G&l=50&co1=AND&d=PTXT&s1=20140513.PD.&OS=ISD/20140513&RS=ISD/20140513

Keywords for this news article include: Analog Devices Inc., Medical Device Companies.

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Source: Journal of Engineering