News Column

Patent Issued for Light Emitting Device and Light Emitting Device Package

May 28, 2014



By a News Reporter-Staff News Editor at Journal of Engineering -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventors Bae, Jung Hyeok (Seoul, KR); Jeong, Young Kyu (Seoul, KR); Park, Kyung Wook (Seoul, KR); Park, Duk Hyun (Seoul, KR), filed on February 18, 2011, was published online on May 13, 2014.

The patent's assignee for patent number 8723213 is LG Innotek Co., Ltd. (Seoul, KR).

News editors obtained the following quote from the background information supplied by the inventors: "Embodiments relate to a light emitting device and a light emitting device package.

"A light emitting diode (LED) is a semiconductor light emitting device converting current to light. In recent years, as the luminance of the LED increases gradually, the use of the LED as a light source for a display, a light source for a vehicle, and a light source for a lighting system is increasing. An LED emitting white light and having superior efficiency may be implemented by using a fluorescent material or combining individual LEDs that emit three primary colors.

"The luminance of the LED depends on various conditions, such as the structure of an active layer, a light extracting structure capable of effectively extracting light to an outside, semiconductor material used in the LED, a chip size, and the type of a molding member enclosing the LED."

As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventors' summary information for this patent: "Embodiments provide a light emitting device and a light emitting device package having a novel structure.

"Embodiments also provide a light emitting device and a light emitting device package having an enhanced reliability.

"Embodiments also provide a light emitting device and a light emitting device package being capable of reducing a light loss.

"In one embodiment, a light emitting device including: a support member; a light emitting structure on the support member, the light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a protective member at a peripheral region of an upper surface of the support member; an electrode including an upper portion being on the first conductive type semiconductor layer, a side portion extended from the upper portion and being on a side surface of the light emitting structure, and an extended portion extended from the side portion and being on the protective member; and an insulation layer between the side surface of the light emitting structure and the electrode.

"In another embodiment, a light emitting device package includes a light emitting device, a package body, a lead electrode, and a socket. The light emitting device includes: a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a protective member at a peripheral region of an upper surface of the support member; an electrode including an upper portion being on the first conductive type semiconductor layer, a side portion extended from the upper portion and being on a side surface of the light emitting structure, and an extended portion extended from the side portion and being on the protective member; and an insulation layer between the side surface of the light emitting structure and the electrode. The package body where the light emitting device is disposed. The lead electrode on the package body, the lead electrode electrically connected to the light emitting device. The socket electrically connected to the electrode of the light emitting device and the lead electrode."

For additional information on this patent, see: Bae, Jung Hyeok; Jeong, Young Kyu; Park, Kyung Wook; Park, Duk Hyun. Light Emitting Device and Light Emitting Device Package. U.S. Patent Number 8723213, filed February 18, 2011, and published online on May 13, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=75&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=3723&f=G&l=50&co1=AND&d=PTXT&s1=20140513.PD.&OS=ISD/20140513&RS=ISD/20140513

Keywords for this news article include: Electronics, Semiconductor, LG Innotek Co. Ltd..

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Source: Journal of Engineering


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