News Column

Patent Application Titled "Multilayer Ceramic Electronic Component and Fabricating Method Thereof" Published Online

May 29, 2014



By a News Reporter-Staff News Editor at Politics & Government Week -- According to news reporting originating from Washington, D.C., by VerticalNews journalists, a patent application by the inventors KIM, Young Ho (Suwon, KR); LEE, Ro Woon (Suwon, KR); LIM, Hyoung Wook (Suwon, KR), filed on January 22, 2013, was made available online on May 15, 2014.

The assignee for this patent application is Samsung Electro-mechanics Co., Ltd.

Reporters obtained the following quote from the background information supplied by the inventors: "The present invention relates to a high capacitance multilayer ceramic electronic component having excellent reliability and a fabricating method thereof.

"In accordance with the recent trend for the miniaturization of electronic products, demand for a multilayer ceramic electronic component having a reduced size and high capacitance has increased.

"Therefore, dielectric layers and internal electrodes have been thinned and stacked in increasing amounts through various methods. Recently, as the thickness of dielectric layers has been reduced, multilayer ceramic electronic components having increased numbers of stacked layers have been fabricated.

"A general fabricating method of a multilayer ceramic capacitor includes preparing a slurry, by mixing a ceramic powder, a binder, a solvent and printing a conductive paste to form an internal electrode, and separating a ceramic sheet from a film to form a multilayer green ceramic body. A green chip is fabricated by compressing the multilayer green ceramic body at high temperature and high pressure to form a hard green multilayer body (Bar) and then performing a cutting process thereon. Then, the ceramic multilayer capacitor is completed by performing a plasticizing process, a firing process, a polishing process, an external electrode coating process, and a plating process thereon.

"Here, stress between an internal electrode and a dielectric layer generated by a difference between contraction and extension causes disconnection. A disconnected part is present in a second phase form due to a reaction between an additive and nickel, and the second phase form has a negative influence on capacitance and breakdown voltage (BDV).

"Therefore, nickel is controlled to be contracted by using a second ceramic powder (BaTiO.sub.3) having a particle diameter of 50 nm or less and a first ceramic powder (BaTiO.sub.3) having a particle diameter of 300 nm or more, similar to a thickness of the internal electrode is applied to naturally form disconnection, such that it is required to deteriorate the stress generated by a difference in a firing temperature between the dielectric layer and the internal electrode, and a disconnected portion is filled with the dielectric layer having electrical characteristics to decrease bad effects such as capacitance and breakdown voltage (BDV) to thereby improve the reliability."

In addition to obtaining background information on this patent application, VerticalNews editors also obtained the inventors' summary information for this patent application: "An aspect of the present invention provides a high capacitance multilayer ceramic electronic component having excellent reliability by applying a first ceramic powder (BaTiO.sub.3) having a particle diameter corresponding to an internal electrode thickness to an internal electrode in order to improve disconnections generated due to differences in contraction and extension between the internal electrode and an dielectric layer.

"According to an aspect of the present invention, there is provided a multilayer ceramic electronic component including: a ceramic body including dielectric layers; internal electrodes disposed to face each other, having the dielectric layers therebetween; and external electrodes formed on outer surfaces of the ceramic body and electrically connected to the internal electrodes, wherein the internal electrodes may include a first ceramic powder formed of barium titanate (BaTiO.sub.3) and having a particle diameter corresponding to 70% to 100% of a thickness of the respective internal electrodes.

"The first ceramic powder may have a particle diameter of 300 nm to 400 nm.

"The first ceramic powder may be included in an amount of 2 wt % to 10 wt % of the internal electrodes.

"The internal electrode may include a second ceramic powder formed of barium titanate (BaTiO.sub.3) and having a particle diameter corresponding to 1% to 20% of the respective internal electrodes.

"The second ceramic powder may have a particle diameter of 10 nm to 50 nm.

"The first ceramic powder may be included in an amount of 2.5 wt % to 12.5 wt %, based on 100 wt % of the second ceramic powder.

"The dielectric layers may be stacked in an amount of 100 layers to 1000 layers.

"The ceramic body may include barium titanate (BaTiO.sub.3).

"According to another aspect of the present invention, there is provided a fabricating method of a multilayer ceramic electronic component, the fabricating method including: preparing ceramic green sheets including dielectric layers; forming internal electrode patterns on the ceramic green sheets by using a conductive paste for an internal electrode including a conductive metal powder and a ceramic powder; stacking and sintering the ceramic green sheets having the internal electrode patterns formed thereon to form a ceramic body including internal electrodes therein, the internal electrodes being disposed so as to face each other; and forming external electrodes on upper and lower surfaces and end surfaces of the ceramic body, wherein in the forming of the conductive paste for an internal electrode, the conductive paste may include a first ceramic powder having a particle diameter corresponding to 70% to 100% of a thickness of the internal electrode.

"The first ceramic powder may have a particle diameter of 300 nm to 400 nm.

"The first ceramic powder may be included in an amount of 2 wt % to 10 wt % of the internal electrode.

"The internal electrode may include a second ceramic powder formed of barium titanate (BaTiO.sub.3) and having a particle diameter corresponding to 1% to 20% of a thickness of the internal electrode.

"The second ceramic powder may have a particle diameter of 10 nm to 50 nm.

"The first ceramic powder may be included in an amount of 2.5 wt % to 12.5 wt % based on 100 wt % of the second ceramic powder.

"The conductive metal powder may be at least one of silver (Ag), lead (Pb), platinum (Pt), nickel (Ni), and copper (Cu).

"The dielectric layers may be stacked in an amount of 100 layers to 1000 layers.

"The ceramic body may include barium titanate (BaTiO.sub.3).

BRIEF DESCRIPTION OF THE DRAWINGS

"The above and other aspects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

"FIG. 1 is a perspective view schematically showing a multilayer ceramic capacitor according to an embodiment of the present invention;

"FIG. 2 is a cross-sectional view taken along line B-B' of FIG. 1;

"FIG. 3 is a view showing an example in which a first ceramic powder is included between internal electrodes;

"FIG. 4 is a scanning electron microscope (SEM) photograph showing a state in which the internal electrodes according to the embodiment of the present invention are filled with the first ceramic powder; and

"FIG. 5 is a view showing a fabricating process of a multilayer ceramic capacitor according to another embodiment of the present invention."

For more information, see this patent application: KIM, Young Ho; LEE, Ro Woon; LIM, Hyoung Wook. Multilayer Ceramic Electronic Component and Fabricating Method Thereof. Filed January 22, 2013 and posted May 15, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=4114&p=83&f=G&l=50&d=PG01&S1=20140508.PD.&OS=PD/20140508&RS=PD/20140508

Keywords for this news article include: Nickel, Chemicals, Chemistry, Heavy Metals, Barium Titanate, Transition Elements, Alkaline Earth Metals, Samsung Electro-mechanics Co. Ltd..

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Source: Politics & Government Week