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Patent Application Titled "Integrated Circuit Package Including Wire Bond and Electrically Conductive Adhesive Electrical Connections" Published...

May 29, 2014



Patent Application Titled "Integrated Circuit Package Including Wire Bond and Electrically Conductive Adhesive Electrical Connections" Published Online

By a News Reporter-Staff News Editor at Politics & Government Week -- According to news reporting originating from Washington, D.C., by VerticalNews journalists, a patent application by the inventor Scheid, David (Eau Claire, WI), filed on November 8, 2012, was made available online on May 15, 2014.

The assignee for this patent application is Honeywell International Inc.

Reporters obtained the following quote from the background information supplied by the inventors: "In some applications, an integrated circuit can be enclosed in a package. The package can provide electrical connections between the integrated circuit and a component on which the package is mounted, e.g., a printed board. The package also may protect the integrated circuit, e.g., from the external environment."

In addition to obtaining background information on this patent application, VerticalNews editors also obtained the inventor's summary information for this patent application: "The disclosure describes an integrated circuit package assembly including an integrated circuit (IC) and an integrated circuit package, where the assembly includes both wire bonds and electrically conductive adhesive connections between electrical contacts of the IC enclosed within the package and electrical contacts of the package. By using both wire bonds and electrically conductive adhesive connections, the number of electrical connections at perimeter of the IC may be increased, e.g., compared to using only wire bonds. In this way, more electrical connections may be made between the package and the IC without increasing a perimeter of the IC or decreasing a pitch between wire bonds. Because the number electrical connections between the IC and the package may impact performance or functionality of the IC in some cases, increasing the number of electrical connections may increase performance or functionality of the IC.

"In one aspect, the disclosure is directed to an IC package assembly that includes a package defining a cavity. In accordance with this aspect of the disclosure, the package includes a first electrically conductive package contact and a second electrically conductive package contact. The package assembly also may include an IC disposed within the cavity. The IC may define a perimeter including an edge, and may include a first electrically conductive IC contact and a second electrically conductive IC contact. The package assembly further may include a wire bond extending between and electrically connecting the first electrically conductive package contact and the first electrically conductive IC contact and an electrically conductive adhesive extending between and electrically connecting the second electrically conductive package contact and the second electrically conductive IC contact.

"In another aspect, the disclosure is directed to an IC package assembly that includes a package defining a cavity and an IC disposed within the cavity. In accordance with this aspect of the disclosure, the package may include a plurality of package signal contacts, a package power contact, and a package ground contact. The IC may define a perimeter including an edge and may include a plurality of IC signal contacts, an IC power contact, and an IC ground contact. The package assembly also may include a plurality of wire bonds extending between and electrically connecting respective ones of the plurality of package signal contacts and respective ones of the plurality of IC signal contacts. Moreover, the package assembly may include a first electrically conductive adhesive trace extending between and electrically connecting the package power contact and the IC power contact and a second electrically conductive adhesive trace extending between and electrically connecting the package ground contact and the IC ground contact.

"In an additional aspect, the disclosure is directed to a method that includes forming, using an electrically conductive adhesive, an electrically conductive trace between a first electrically conductive package contact of a package and a first electrically conductive IC contact of an IC disposed in a cavity defined by the package. The method also may include electrically connecting a second electrically conductive package contact of the package and a second electrically conductive IC contact of the IC using a wire bond.

"The details of one or more examples are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the disclosure will be apparent from the description and drawings, and from the claims.

BRIEF DESCRIPTION OF DRAWINGS

"FIG. 1 is a conceptual cross-sectional diagram that illustrates an example IC package assembly that includes wire bonds and electrically conductive adhesive traces.

"FIG. 2 is a conceptual diagram that illustrates a plan view of a portion of an example package base and an example IC.

"FIG. 3 is a conceptual cross-sectional diagram that illustrates an example IC package assembly that includes wire bonds and electrically conductive adhesive traces.

"FIG. 4 is a conceptual diagram that illustrates a plan view of a portion of an example package base and an example IC.

"FIG. 5 is a conceptual cross-sectional diagram that illustrates an example IC package assembly that includes wire bonds and multiple layers of electrically conductive adhesive traces.

"FIG. 6 is a conceptual diagram that illustrates a plan view of a portion of an example package base and an example IC.

"FIG. 7 is a flow diagram that illustrates an example technique for forming an IC package assembly that includes wire bonds and electrically conductive adhesive traces.

"FIG. 8 is a flow diagram that illustrates another example technique for forming an IC package that includes wire bonds and electrically conductive adhesive traces."

For more information, see this patent application: Scheid, David. Integrated Circuit Package Including Wire Bond and Electrically Conductive Adhesive Electrical Connections. Filed November 8, 2012 and posted May 15, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=5261&p=106&f=G&l=50&d=PG01&S1=20140508.PD.&OS=PD/20140508&RS=PD/20140508

Keywords for this news article include: Honeywell International Inc.

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Source: Politics & Government Week


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