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Researchers Submit Patent Application, "Multilayered Ceramic Electronic Component and Board for Mounting the Same", for Approval

May 28, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors Park, Myung Jun (Gyunggi-Do, KR); Park, Kyu Sik (Gyunggi-Do, KR); Lee, Young Sook (Gyunggi-Do, KR); Choi, Jae Yeoul (Gyunggi-Do, KR); Kim, Doo Young (Gyunggi-Do, KR), filed on December 14, 2012, was made available online on May 15, 2014.

The patent's assignee is Samsung Electro-mechanics Co., Ltd.

News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a multilayered ceramic electronic component capable of decreasing acoustic noise generated by the multilayered ceramic electronic component when a voltage is applied thereto, and a board for mounting the same.

"Examples of an electronic component using a ceramic material include a capacitor, an inductor, a piezoelectric material, a varistor, a thermistor, and the like.

"Among these ceramic electronic components, a multilayered ceramic capacitor (MLCC) has compactness, high capacitance, ease of mounting, and the like.

"A multilayered ceramic capacitor is a chip type condenser mounted on a circuit board of electronic products such as computers, personal digital assistants (PDAs), and cellular phones, to perform an important role in charging and discharging electricity and has various sizes and multilayered forms, according to use and required capacitance.

"In particular, recently, in accordance with the miniaturization of electronic products, a subminiature size and ultra high capacitance have been demanded in a multilayered ceramic capacitor used in miniaturized electronic products.

"Therefore, a multilayered ceramic capacitor in which thicknesses of dielectric layers and internal electrodes are reduced in order to allow the electronic product to have a subminiature size and an increased amount of dielectric layers provided with internal electrodes thereon are provided in order to allow the electronic product to have ultra high capacitance has been manufactured.

"Meanwhile, there is provided a multilayered ceramic capacitor in which all external electrodes are positioned on a lower surface thereof. The multilayered ceramic capacitor having this structure has advantages in that mounting density and capacitance thereof are excellent and equivalent series inductance (ESL) is low, but has a defect in which adhesion strength is relatively low and one surface of a multilayered body may be bent, such that cracks may be generated.

"In order to solve the above-mentioned defects, a relatively large amount of solder fillet has been used at the time of mounting the multilayered ceramic capacitor on the printed circuit board.

"In this case, due to a phenomenon in which the solder fillet overflows at the time of reflow, a defect may occur or a mounting area of the multilayered ceramic capacitor may be increased.

"In addition, due to the above-mentioned defect, vibrations are transferred to the printed circuit board, such that an acoustic noise phenomenon may increase.

"Therefore, research into a technology capable of decreasing the acoustic noise phenomenon simultaneously with decreasing the mounting area of the multilayered ceramic capacitor has been required.

"In the following Patent Document, Patent Document 1 discloses a ceramic electronic component in which a conductive resin layer is deposited on an end portion of a metal plated layer on a main surface of a multilayered body in order to enhance impact resistance. In addition, the following Patent Document discloses a ceramic electronic component capable of preventing solder overflow in welding by adjusting thicknesses of a palladium (Pd) plated layer and a gold (Au) plated layer that form external electrodes.

"However, these Patent Documents neither disclose nor anticipate a feature of preventing solder overflow in welding using a nonconductor layer that is suggested in the claims and embodiments of the present invention."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "An aspect of the present invention provides a multilayered ceramic electronic component in which a mounting area may be decreased by preventing solder from overflowing onto an upper portion of the multilayered ceramic electronic component in a thickness direction when a printed circuit board and the multilayered ceramic electronic component are soldered to each other.

"Another aspect of the present invention provides a board for mounting a multilayered ceramic electronic component capable of decreasing acoustic noise by mounting the multilayered ceramic electronic component on a printed circuit board.

"According to an aspect of the present invention, there is provided a multilayered ceramic electronic component including: a ceramic body including a dielectric layer and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second ends opposing each other; first and second internal electrodes having an overlapping region provided in the ceramic body, forming a capacitance forming area exposed to the first side surface, the first internal electrode having a first lead-out portion extended from the capacitance forming area so as to be exposed to the first side surface, and the second internal electrode being insulated from the first internal electrode and having a second lead-out portion extended from the capacitance forming area so as to be exposed to the first side surface; a first external electrode connected to the first lead-out portion and extended to the first end of the ceramic body, and a second external electrode connected to the second lead-out portion and extended to the second end of the ceramic body; and an insulating layer formed on the first side surface of the ceramic body, wherein the first and second external electrodes formed on the first and second ends further include non-conductive layers formed on outer surfaces thereof.

"The non-conductive layers may include at least one selected from a group consisting of epoxy, a heat resistant polymer, glass, and ceramic.

"The first and second internal electrodes may be disposed perpendicularly with regard to a mounting surface of the ceramic body.

"The first external electrode may be extended to at least one of the first main surface, the second main surface, and the second side surface of the ceramic body.

"The second external electrode may be extended to at least one of the first main surface, the second main surface, and the second side surface of the ceramic body.

"The insulating layer may include at least one selected from a group consisting of epoxy, a heat resistant polymer, glass, and ceramic.

"The insulating layer may cover the entirety of the exposed portions of the first and second internal electrodes overlapped with each other.

"The insulating layer may have a thickness lower than those of the first and second external electrodes measured from the first side surface of the ceramic body.

"According to another aspect of the present invention, there is provided a board for mounting a multilayered ceramic electronic component, the board including: the multilayered ceramic electronic component as described above; electrode pads connected to the external electrodes of the multilayered ceramic electronic component using solder fillets; and a printed circuit board having the electrode pads formed therein, wherein the solder fillets are formed up to one end of the non-conductive layers adjacent to the printed circuit board.

"The non-conductive layers may include at least one selected from a group consisting of epoxy, a heat resistant polymer, glass, and ceramic.

"The first and second internal electrodes may be disposed perpendicularly with regard to amounting surface of the ceramic body.

"The first external electrode may be extended to at least one of the first main surface, the second main surface, and the second side surface of the ceramic body.

"The second external electrode may be extended to at least one of the first main surface, the second main surface, and the second side surface of the ceramic body.

"The insulating layer may include at least one selected from a group consisting of epoxy, a heat resistant polymer, glass, and ceramic.

"The insulating layer may cover the entirety of the exposed portions of the first and second internal electrodes overlapped with each other.

"The insulating layer may have a thickness lower than those of the first and second external electrodes measured from the first side surface of the ceramic body.

BRIEF DESCRIPTION OF THE DRAWINGS

"The above and other aspects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

"FIG. 1 is a schematic perspective view showing a multilayered ceramic capacitor according to an embodiment of the present invention;

"FIG. 2 is a schematic perspective view showing the multilayered ceramic capacitor according to the embodiment of the present invention viewed in a different direction;

"FIG. 3 is a cross-sectional view showing a structure of internal electrodes of the multilayered ceramic capacitor shown in FIGS. 1 and 2;

"FIG. 4 is a cross-sectional view taken along line A-A' of FIG. 2; and

"FIG. 5 is a schematic perspective view schematically showing a form in which the multilayered ceramic capacitor according to the embodiment of the present invention is mounted on a printed circuit board."

For additional information on this patent application, see: Park, Myung Jun; Park, Kyu Sik; Lee, Young Sook; Choi, Jae Yeoul; Kim, Doo Young. Multilayered Ceramic Electronic Component and Board for Mounting the Same. Filed December 14, 2012 and posted May 15, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=5971&p=120&f=G&l=50&d=PG01&S1=20140508.PD.&OS=PD/20140508&RS=PD/20140508

Keywords for this news article include: Electronics, Circuit Board, Samsung Electro-mechanics Co. Ltd.

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Source: Electronics Newsweekly


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