The patent's assignee is
News editors obtained the following quote from the background information supplied by the inventors: "The instant disclosure relates to an electronic component and method of manufacturing the same; in particular, to an electronic package module and method of manufacturing the same.
"Typically, a conventional electronic package module includes a circuit board and a plurality of electronic components disposed thereon. The electronic components may be, for example, chip packages, passive components or the like. In addition, the majority of the electronic package modules further include molding compounds to encapsulate the electronic components and provide protection of the electronic components.
"However, certain electronic components, especially photoelectric components such as CMOS Image Sensors (CISs), Charge-Coupled Devices (CCDs), Light Emitting Diodes (LEDs), or the like are not suitable to be encapsulated by molding compounds. It is common that the electronic package module which contains a photoelectric component and a non-photoelectric component does not have molding compound to ensure that the photoelectric components can be in normal operation."
As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "The instant disclosure is to provide an electronic package module which includes a plurality of electronic components and a molding compound. The molding compound only encapsulates at least one of the electronic components and does not encapsulate all of the electronic components.
"The instant disclosure also provides a method of manufacturing the aforementioned electronic package module.
"According to one exemplary embodiment of the instant disclosure, an electronic package module includes a circuit board, at least one first electronic component, at least one second electronic component and at least one molding compound. The circuit board has a supporting surface. The first and second electronic components are mounted on the supporting surface. The molding compound is arranged on the supporting surface and partially covers the supporting surface. The molding compound encapsulates at least one first electronic component but does not encapsulate the second electronic component.
"According to another exemplary embodiment of the instant disclosure, a method of manufacturing the electronic package module is provided. Firstly, a circuit board assembly is provided. The circuit board assembly includes a circuit board having a supporting surface, at least one first electronic component and at least one second electronic component. Then a mask pattern layer is formed on the circuit board assembly. The first and second electronic components are mounted on the supporting surface. The mask pattern layer with at least one hollow region partially covers the supporting surface. The first electronic component is positioned to the hollow region. In addition, the mask pattern layer completely covers the second electronic component. Subsequently, a molding compound is formed in the hollow region and encapsulates the first electronic component. After the formation of molding compound, the mask pattern layer is removed, and thus the second electronic component is exposed.
"Therefore, the electronic package module includes the molding compound encapsulating at least one of the electronic components. Thus, the conventional electronic package module containing a photoelectric component (for example, an image sensor or a light emitting unit) can utilize the instant disclosure to allow partial coverage for electronic components. In other words, the molding compound can encapsulate the requisite electronic component and not encapsulate the electronic component such as the photoelectric component, which is not suitable to be encapsulated. Hence, the molding compound does not affect the normal operation of the photoelectric component and meanwhile protects the other electronic components. Note that the instant disclosure is not limited to protection of electronic components (regardless being encapsulated or not) and other active or passive components can also be applied.
"In order to further understand the instant disclosure, the following embodiments are provided along with illustrations to facilitate the appreciation of the instant disclosure; however, the appended drawings are merely provided for reference and illustration, without any intention to be used for limiting the scope of the instant disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
"FIG. 1A is a top schematic view of an electronic package module in accordance with an embodiment of the instant disclosure.
"FIG. 1B is a cross-sectional schematic view along line I-I in FIG. 1A.
"FIGS. 2A to 2H are cross-sectional schematic views of FIG. 1B showing a method of manufacturing the electronic package module.
"FIGS. 3A to 3C are cross-sectional schematic views showing a method of manufacturing an electronic package module in accordance with another embodiment of the instant disclosure."
For additional information on this patent application, see: CHEN, JEN-CHUN; CHANG, HSIN-CHIN. Electronic Pacakge Module and Method of Manufacturing the Same. Filed
Keywords for this news article include: Circuit Board, Electronic Components,
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