News Column

Researchers Submit Patent Application, "Connection Structure of Circuit Board", for Approval

May 28, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventor Lee, Jin-Suk (Yongin-city, KR), filed on September 11, 2013, was made available online on May 15, 2014.

The patent's assignee is Samsung Display Co., Ltd.

News editors obtained the following quote from the background information supplied by the inventors: "The described technology generally relates to a connection structure of a circuit board.

"In general, a liquid crystal display (LCD) or an organic light emitting diode (OLED) display includes a switching device such as a thin film transistor (TFT) and a light emitting device disposed on a display substrate. In order to apply a driving signal to the switching device, a circuit board including a driver integrated circuit (IC) for generating the driving signal must be electrically connected to the display substrate. Generally, a flexible printed circuit board (FPCB) is disposed between the circuit board and the display substrate to connect the circuit board to the display substrate."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventor's summary information for this patent application: "One inventive aspect is a connection structure between a first circuit board and a second circuit board.

"Another aspect is a connection structure of a circuit substrate capable of preventing electrical short.

"Another aspect is a connection structure of a circuit board which includes a first circuit board, a second circuit board and adhesive member. A first connection pad and a second connection pad are disposed on the first circuit board. The second circuit board has a first surface facing the first circuit board. A plurality of third connection pads and fourth connection pads are disposed on the first surface of the second circuit board in a staggered pattern. The adhesive member is disposed between the first circuit board and the second circuit board. At least one of the third connection pad and the fourth connection pad is electrically connected to a wire which is disposed on a second surface of the second circuit board opposite to the first surface of the second circuit board.

"In example embodiments, the third connection pads and the fourth connection pads may be alternately and repeatedly disposed in a second direction, and the third connection pads may be disposed closer to an end of the second circuit board as compared with the fourth connection pads in a first direction substantially perpendicular to the second direction

"In example embodiments, each of the third connection pads may be electrically connected to a second wire disposed on the second surface of the second circuit board, and each of the fourth connection pads may be electrically connected to a first wire disposed on the first surface of the second circuit board.

"In example embodiments, the second circuit board may further comprise fifth connection pads disposed on the second surface, and each of the fifth connection pads may be electrically connected to each of the third connection pads through a first contact formed through the second circuit board while being directly connected to each of the second wires.

"In example embodiments, the second circuit board may further comprise a dummy pad disposed between the fifth connection pads.

"In example embodiments, the dummy pad may have a height equal to a height of the fifth connection pad, and may comprise an insulation material

"In example embodiments, each of the third connection pads may be electrically connected to a second wire disposed on the second surface of the second circuit board, and each of the fourth connection pads may be electrically connected to a first wire disposed on the second surface of the second circuit board.

"In example embodiments, the second circuit board may further comprise fifth connection pads and sixth connection pads which are disposed on the second surface, each of the fifth connection pads may be electrically connected to each of the third connection pads through a first contact formed through the second circuit board while being directly connected to each of the second wires, and each of the sixth connection pads may be electrically connected to each of the fourth connection pads through a second contact formed through the second circuit board while being directly connected to each of the first wires

"In example embodiments, the second circuit board may further comprise a dummy pad disposed between the fifth connection pads.

"In example embodiments, the dummy pad may have a height equal to a height of the fifth connection pad, and comprises an insulation material.

"In example embodiments, the first connection pad and the second connection pad may be disposed in a staggered pattern

"In example embodiments, the first connection pad and the second connection pad may be electrically connected to a third wire disposed on an upper surface of the first circuit board, respectively.

"In example embodiments, the first connection pad and the second connection pad may be electrically connected to a third wire disposed inside the first circuit board or at a lower surface of the first circuit board.

"Another aspect is a second circuit board which includes a third connection pad, a fourth connection pad, a first wire, and a second wire. The third connection pad and the fourth connection pad can be disposed in a staggered pattern, and the first wire electrically connected to the fourth connection pad can be spaced apart from the second wire electrically connected to the third connection pad. Accordingly, adjacent conductors can be spaced apart from each other at a predetermined distance or more and the short can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

"Example embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings. FIGS. 1 to 13 represent non-limiting, example embodiments as described herein.

"FIGS. 1 to 6 are a perspective view, plan views, and cross-sectional views illustrating a connection structure of a circuit board according to example embodiments.

"FIGS. 7 to 11 are a perspective view, plan views, and cross-sectional views illustrating a connection structure of a circuit board according to example embodiments.

"FIGS. 12 and 13 are a perspective view and a plan view illustrating a connection structure of a circuit board according to example embodiments, respectively."

For additional information on this patent application, see: Lee, Jin-Suk. Connection Structure of Circuit Board. Filed September 11, 2013 and posted May 15, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=2308&p=47&f=G&l=50&d=PG01&S1=20140508.PD.&OS=PD/20140508&RS=PD/20140508

Keywords for this news article include: Electronics, Circuit Board, Samsung Display Co. Ltd.

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC


For more stories covering the world of technology, please see HispanicBusiness' Tech Channel



Source: Electronics Newsweekly