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System thin film deposition by sputtering

May 2, 2014

Contract notice: Contract no 2014-29: system thin film deposition by sputtering system for depositing thin films by sputteringthis contract is: the acquisition of a cathode de.pulvÉrisation system for depositing thin films on Si wafer substrate type, Asga, In, alumina, pyrex, glass, etc.. This equipment will be dedicated to advanced research in the fields of micro and nano-fabrication. Procedure: It is awarded according to the procedure of open tender subject to the provisions of the ordinance of June 6, 2005 and amended decree of 30 December 2005 amended (laying down rules applicable to contracts awarded by contracting authorities referred to Article 3 of Ordinance No. 2005-649 of 6 June 2005 on the past by certain public or private persons not subject to the Public Procurement Code) and 25 April 2007 markets. period of execution of the contract The equipment must always be delivered, installed and operated on-site by the end of December 2014 or within a period of 5.5 months at the latest from the notification of this market This contract is divided into lots: no Time limit for receipt of tenders or requests to participate: 6.6.2014 - 12:00 Language(s) in which tenders or requests to participate may be drawn up: French.


Address : Place EugÈne Bataillon 34095 Montpellier Cedex 5 FRANCE Contact point(s): Service des marchÉs CC 421 For the attention of: Mme Luporsi BÉnÉdicte

Country :France

Email :

Url :

Address : NiversitÉ Montpellier 2 bÂtiment 21 (1er Étage) CC 075 place EugÈne Bataillon Contact point(s): Centrale de technologie For the attention of: M. Giani Alain 34095 Montpellier Cedex 5 Telephone: +33 467143713 E-mail: Fax: +33 467143783

Tender notice number : 145962-2014

Notice type : Tender Notice

Open date : 2014-06-06

Tender documents : T22040935.html

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Source: TendersInfo (India)