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Alpha & Omega Semiconductor Assigned Patent for Method of Using Bonding Ball Array as Height Keeper and Paste Holder in Semiconductor Device...

May 19, 2014



Alpha & Omega Semiconductor Assigned Patent for Method of Using Bonding Ball Array as Height Keeper and Paste Holder in Semiconductor Device Package

By Targeted News Service

ALEXANDRIA, Va., May 19 -- Alpha & Omega Semiconductor, Sunnyvale, California, has been assigned a patent (8,722,467) developed by Lei Shi, Songjiang, China, Aihua Lu, Songliang, China, and Yan Xun Xue, Los Gatos, California, for a "method of using bonding ball array as height keeper and paste holder in semiconductor device package."

The patent application was filed on June 30, 2012 (13/539,304). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8,722,467.PN.&OS=PN/8,722,467&RS=PN/8,722,467

Written by Deviprasad Jena; edited by Jaya Anand.

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Source: Targeted News Service