News Column

Patent Issued for Organic Light Emitting Diode Module

May 21, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventors Lin, Chen-Chi (Hsin-Chu, TW); Hung, Chih-Yi (Hsin-Chu, TW), filed on December 17, 2012, was published online on May 6, 2014.

The patent's assignee for patent number 8716705 is AU Optronics Corporation (Hsin-Chu, TW).

News editors obtained the following quote from the background information supplied by the inventors: "The present disclosure relates to a light emitting device, and more particularly to an organic light emitting diode module.

"An organic light emitting diode (OLED) includes an anode conductive layer, an organic light emitting layer, and a cathode conductive layer. Generally, the anode conductive layer is indium tin oxide (ITO), and the cathode conductive layer is a metal sheet. The organic light emitting layer is located between the anode and cathode conductive layers, such that the organic light emitting diode has a layered structure with the organic light emitting layer sandwiched between the anode and cathode conductive layers. When power is provided to the anode and cathode conductive layers, the organic light emitting layer can emit light. Since the organic light emitting diode is self-emissive, a backlight module does not need to be assembled to the organic light emitting diode, and the organic light emitting diode has wider viewing angles and better brightness compared with a liquid crystal display panel. Moreover, the organic light emitting diode has a low driving voltage, and is further associated with the advantages of fast reaction, light weight, a thin profile, low energy consumption, simple structure, and reduced cost. Therefore, organic light emitting diode modules are used in the screens of various consumer electronic products (e.g., cellular phones and tablet computers).

"In order to achieve uniform brightness in a conventional organic light emitting diode module, four electrodes are often respectively arranged on four sides of a substrate of the organic light emitting diode module during the manufacturing process. Two opposite electrodes from among the four electrodes are electrically connected to the anode conductive layer of the OLED module, and the other two opposite electrodes from among the four electrodes are electrically connected to the cathode conductive layer of the OLED module. Four flexible printed circuit boards (FPC) are respectively connected to the four electrodes, and each of the flexible printed circuit boards has a connector to connect to a power supply through a conductive wire.

"However, the cost of the flexible printed circuit board is high, and the thickness of the connector is significant (more than 2.5 mm). The thickness of the connector is such that the thickness of the whole organic light emitting diode module is not easily reduced. Furthermore, the conventional organic light emitting diode module needs the four conductive wires to connect to the four flexible printed circuit boards, such that the cost of assembling the organic light emitting diode module is increased."

As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventors' summary information for this patent: "An aspect of the present invention is to provide an organic light emitting diode module.

"In an embodiment of the present invention, an organic light emitting diode module includes a substrate, a first electrode, a pair of second electrodes, a light emitting element, a first copper foil, a pair of second copper foils, and a cross connection conductor. The first electrode is located on the substrate. The second electrodes are located on the substrate, and are in an arrangement opposite to one another. The light emitting element is located on the substrate and includes a first electrode layer, a second electrode layer, and an organic light emitting layer. The first electrode layer is electrically connected to the first electrode. The second electrode layer is located between the second electrodes, and is electrically connected to the second electrodes. The organic light emitting layer is located between the first and second electrode layers. The first copper foil is electrically connected to the first electrode. The second copper foils are respectively electrically connected to the second electrodes. The cross connection conductor is electrically connected to the second copper foils.

"In an embodiment of the present invention, the cross connection conductor is a third copper foil.

"In an embodiment of the present invention, the third copper foil and the second copper foils form a U-shaped configuration when viewed from above.

"In an embodiment of the present invention, the third copper foil and the second copper foils are formed as a single piece.

"In an embodiment of the present invention, the organic light emitting diode module further includes at least one conductive adhesive. The conductive adhesive adheres the third copper foil and the second copper foils.

"In an embodiment of the present invention, the third copper foil includes two opposite end portions along the length direction thereof. Each of the second copper foils includes a connecting portion adjacent to the third copper foil. The two opposite end portions of the third copper foil respectively overlap the connecting portions of the second copper foils.

"In an embodiment of the present invention, the organic light emitting diode module further includes at least one conductive adhesive. The conductive adhesive adheres the two opposite end portions of the third copper foil and the connecting portions of the second copper foils.

"In an embodiment of the present invention, the cross connection conductor is a conductive wire.

"In an embodiment of the present invention, the organic light emitting diode module further includes a third electrode. The third electrode is located on the substrate, and is opposite to the first electrode. The first electrode layer is located between the first and third electrodes, and is electrically connected to the first and third electrodes.

"In an embodiment of the present invention, the cross connection conductor is disposed above the third electrode overlapping at least a portion of the third electrode.

"In an embodiment of the present invention, the organic light emitting diode module further includes an insulating layer. The insulating layer is located between the third electrode and the cross connection conductor.

"In an embodiment of the present invention, the organic light emitting diode module further includes a power supply. The power supply provides a negative potential to the first copper foil and provides a positive potential to the second copper foils.

"In an embodiment of the present invention, the organic light emitting diode module further includes a first conductive wire and at least one second conductive wire. The first conductive wire is electrically connected to the first copper foil. The second conductive wire is electrically connected to at least one of the second copper foils and the cross connection conductor.

"In an embodiment of the present invention, a volume conductivity of the first copper is larger than 100.times.10.sup.-6 Ohmcm.

"In an embodiment of the present invention, a volume conductivity of each of the second copper foils is larger than 100.times.10.sup.-6 Ohmcm.

"In an embodiment of the present invention, the thickness of each of the second copper foils is smaller than 0.5 mm.

"In an embodiment of the present invention, the organic light emitting diode module further includes a protection cover. The protection cover is located on the first and the second electrodes.

"In an embodiment of the present invention, the organic light emitting diode module further includes a packaging gel. The packaging gel adheres the protection cover on the first and the second electrodes.

"In the aforementioned embodiments of the present invention, since the cross connection conductor of the organic light emitting diode module is electrically connected to the second copper foils, an end of a conductive wire can be selectively electrically connected to one of the cross connection conductor and the second copper foils, and another end of the conductive wire is electrically connected to an anode of the power supply, such that the power supply can provide the positive potential to the second copper foils at the same time. Moreover, two ends of another conductive wire can be connected respectively to the first copper foil and a cathode of the power supply, such that the power supply can provide the negative potential to the first copper foil. As a result, the organic light emitting diode module in the aforementioned embodiments can have uniform brightness by only the two conductive wires connected to the power supply, and the cost of the copper foils is cheaper than the cost of conventional flexible printed circuit boards, such that the material cost and the assembly cost of the organic light emitting diode module can be reduced. Furthermore, the copper foils can be connected to the conductive wires without any connectors (e.g., by soldering), such that the thickness of the organic light emitting diode module can be decreased."

For additional information on this patent, see: Lin, Chen-Chi; Hung, Chih-Yi. Organic Light Emitting Diode Module. U.S. Patent Number 8716705, filed December 17, 2012, and published online on May 6, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=76&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=3766&f=G&l=50&co1=AND&d=PTXT&s1=20140506.PD.&OS=ISD/20140506&RS=ISD/20140506

Keywords for this news article include: Electronics, Circuit Board, Light-emitting Diode, AU Optronics Corporation.

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Source: Electronics Newsweekly