News Column

Patent Issued for MEMS Substrates, Devices, and Methods of Manufacture

May 6, 2014



By a News Reporter-Staff News Editor at Journal of Technology -- Infineon Technologies AG (Neubiberg, DE) has been issued patent number 8703516, according to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

The patent's inventor is Schoen, Florian (Munich, DE).

This patent was filed on July 15, 2008 and was published online on April 22, 2014.

From the background information supplied by the inventors, news correspondents obtained the following quote: "MEMS devices comprise a relatively new technology that combines semiconductors with very small mechanical devices. MEMS devices are micro-machined sensors, actuators, and other structures that are formed by the addition, subtraction, modification, and patterning of materials using techniques originally developed for the integrated circuit industry. MEMS devices are used in a variety of applications, such as in sensors for motion controllers, inkjet printers, airbags, microphones, and gyroscopes, as examples. The applications that MEMS devices are used in continue to expand and now also include applications such as mobile phones, automobiles, global positioning systems (GPS), video games, consumer electronics, automotive safety, and medical technology, as examples.

"Manufacturing MEMS devices is challenging in many aspects. Fabricating small moving parts of MEMS devices with lithography processes used in semiconductor technology has limitations in some applications.

"Some MEMS devices are fabricated on silicon-on-insulator (SOI) substrates. However, SOI substrates are more expensive than bulk substrates; thus, lower cost MEMS devices would be achievable if MEMS devices were to be manufactured on bulk substrates.

"Thus, what are needed in the art are improved substrates for MEMS devices, methods of manufacture thereof, and more cost-effective MEMS devices and methods of manufacture thereof."

Supplementing the background information on this patent, VerticalNews reporters also obtained the inventor's summary information for this patent: "These and other problems are generally solved or circumvented, and technical advantages are generally achieved, by embodiments of the present invention, which provide novel MEMS devices and methods of manufacture thereof, wherein a MEMS region is formed on a bulk substrate by implanting a substance such as oxygen or nitrogen locally into the substrate, and an isolation ring is formed above and around a perimeter of the oxidized or nitrided implantation region.

"In accordance with an embodiment of the present invention, a MEMS device includes a workpiece having an isolation ring in a top portion thereof, and a moveable element disposed within the isolation ring.

"The foregoing has outlined rather broadly the features and technical advantages of embodiments of the present invention in order that the detailed description of the invention that follows may be better understood. Additional features and advantages of embodiments of the invention will be described hereinafter, which form the subject of the claims of the invention. It should be appreciated by those skilled in the art that the conception and specific embodiments disclosed may be readily utilized as a basis for modifying or designing other structures or processes for carrying out the same purposes of the present invention. It should also be realized by those skilled in the art that such equivalent constructions do not depart from the spirit and scope of the invention as set forth in the appended claims."

For the URL and additional information on this patent, see: Schoen, Florian. MEMS Substrates, Devices, and Methods of Manufacture. U.S. Patent Number 8703516, filed July 15, 2008, and published online on April 22, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=90&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=4455&f=G&l=50&co1=AND&d=PTXT&s1=20140422.PD.&OS=ISD/20140422&RS=ISD/20140422

Keywords for this news article include: Infineon Technologies AG.

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Source: Journal of Technology


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